Molex Inc., in conjunction with Neoconix, introduces the Molex FlexBeam Tool-Less Copper Flex Interposer. The high-speed, copper flex assembly from Molex joins Neoconix’s HD&S PCBeam interposer to provide high-density interface for flex-to-PCBA applications.
 
The product is a low profile, flex-to-board interface providing densities of 1.00 mm or less in numerous pin-matrix configurations. A z-axis is added to traditional 2D PCB processing through all-metal spring beams permanently embedded onto an FR-4 substrate.
 
With photolithography and etch-based processes, the interposer provides dimensional control that is scalable to very fine feature sizes for applications having space constraints. The integrated copper flex assembly enables signal speeds greater than 10 Gbps and single-ended speed of 4 GHz and higher.
 
Users can achieve board-to-flex pin counts of 500 input/outputs or greater, and a dual-beam option is available for contact redundancy in high-reliability applications. 
 
www.molex.com 
 
 
 
 

Vishay Intertechnology Inc. introduces IHLW-5050CE-01, IHLP inductor.
 
This is the first winged, low profile, high-current inductor and is designed to be placed on a cut-out PCB. It offers a high-current solution without exceeding a 1.2-mm profile on either side of the board.
 
With a frequency range up to 5 MHz, the product is reported to handle high transient current spikes without hard saturation. Specified for operating temperatures ranging from 55° C to +125° C, the product is RoHS-compliant and resistant to thermal and mechanical shock, moisture and vibration.   
 
www.vishay.com

Rogers RO2808 material combines high dielectric constant with a thin dielectric thickness to achieve high capacitance per unit area. Electrical performance enhancements can significantly increase density of integrated components and reduce the package module footprint.

The ceramic filler improves dimensional stability, laser machining and surface topography. Features include low dissipation factor and low copper profile options that offer low loss and high Q factor for signal propagation in fine line/space, high I/O count designs.

RO2808 is available with a dielectric thickness of 0.0011 inch +/- 0.00017 inch. This is supplied with one-half ounce, low profile copper foil with a 0.0950 µm treated side root mean square surface roughness. RO2808 is also provided as a bonding film.

www.rogerscorp.com/acm/index.aspx

Keithley Instruments Inc. introduces its 2009 Test and Measurement Product Guide. The 144-page guide provides technical specifications and details for the company’s extensive products and solutions.
 
Arranged by product type and application area, the guide included sections containing the latest test and measurement innovations. Users will find choosing the proper solution for specific applications is easier with the useful selector guide.