E³.EDM Data Management Solution manages E³.series design data in its native format. Builds on Zuken’s E³.series and Contact Software’s CIM Database EDM platform to provide data and process management integrated into E³.series for wire, harness, cable, control system and fluid design.

Read more: Zuken Introduces E3.EDM Data Management Solution

Sarcon 25GR-T2d thermal interface material is conformable gap filler pad with a reinforced mesh center. Is for applications that require a thermal interface bridge across larger surface areas. Is reportedly an alternative to thin films when it is not possible to exert a large amount of force between the heat spreader, housing, PCB and heat sink. Is 0.25mm thick; delivers a thermal conductivity of 1.5 W/m°K and a thermal resistance of 0.40°Cin²/W at 43.5 psi. Is recommended for applications with operational temperatures between -40°C and +150°C. Can be ordered in 10m rolls or pre-cut sheets up to a max size of 200mm x 300mm.

Fujipoly America Corp., http://www.fujipoly.com

 

GreenJet digital 3D printing system is used for deposition of solder mask on printed circuit boards. Is a single-step zero-clearance digital solder mask deposition system. Reportedly replaces coating, drying, exposure and development processes currently used in PCB manufacturing.

Camtek, http://www.camtekusa.com/

Circuit Scribe rollerball pen comes filled with specially formulated conductive ink that dries instantly. Draws electronics circuits instantly. Produces lasts 60 to 80 meters of conductive lines. Conductivity is 50-100 milliohms per square per mil.

Electroninks Incorporated, http://www.electroninks.com/