Cupracid AC conformal plating process permits high throwing power in BMV’s and through-holes at high current density. Provides a uniform surface distribution leading to a reduced plated copper thickness of about 3μm. Is a DC (direct current) process for high volume using vertical conveyorized line/plating and sparger electrolyte agitation. Permits conformal copper plating with soluble anodes in DC mode. All additives can be controlled using CVS (cyclic voltammetric stripping). May also be used with air agitation in hoist type equipment. In tests, a plating time of 60 min. and a current density of 3 A/dm², the throwing power of a 1.2mm thick panel with hole diameters of 0.3/0.25mm showed >95% min throwing power at 0.3mm and >90% min at 0.25mm.

Atotech, www.atotech.com

Ansys 15.0 simulation software optimizes product designs for structures, fluids and electromagnetics. Enables multiphysics workflows for simulation practices. Enhancements feature the capability for studying turbomachinery flow paths; in electromagnetic, it offers an electric motor design process. Can mesh model size and complexity. Reportedly speeds performance by a factor of five. Extends evaluation of product performance of composites materials. Facilitates submodeling techniques in pre-processing workflow. Introduces multiphysics approach to composites simulation to optimize wireless design and thermal management. Defines spatially dependent material properties for electromagnetic simulation and then couples results to the structural analysis. Features include improved performance with new solvers; bolt thread modeling as a contact; multiple finite element models that can be assembled.

Ansys, www.ansys.com/ansys15.0