AVIA NX series of q-switched, diode-pumped, solid-state lasers offer output powers up to 40W at 355nm. Are said to be smaller, lighter, and more robust than other UV lasers of the same power level. Feature patented pumping technology of the Nd:YVO4 gain medium, for increased overall system efficiency (conversion of input electrical energy into usable light). Also incorporates novel optical mounting technology, for enhanced stability and long-term reliability. For PCB via hole drilling, drilling and cutting of flex materials, 3D IC chip fabrication, IC chip package trimming, as well as other processes in support of system-in-package (SiP) manufacture. 

Coherent, www.coherent.com.   

brd-to-3D virtual 3D Eagle viewer takes layout file (more formats to be released) and generates a “free” comprehensive 3D package consisting of:

• Photo-realistic images of the printed circuit board and SMT stencil
• A STEP file of the virtually assembled PCB
• A PDF formatted 3D view that rotates freely allowing all angles of viewing

Comes with a free laser-sintered 3D model of the assembled PCB, with purchase of prototype order. 

Beta Layout, http://www.pcb-pool.com/ppus/index.html

For a video on how this works, click here: www.pcbpool.com/ppus/info_video_3d_simlab.html

or here  www.pcb-pool.com/ppus/info_video_3d_freecad.html

White Teijin Tetoron UF Polyethylene Terephthalate films (PET) and Teonex QF Polyethylene Naphthalate (PEN) films are halogen-free and flame-retardant. Combine chemical resistance, strength and insulation properties with the VTM-0 flame rating available from UL’s UL 94 flame classification testing. Are available in thicknesses ranging from 25 to 250µm. Typical applications include insulating materials and labels for electronic products. At thicknesses of 125 µm or more, the films provide more than 90% diffuse reflectance across the visible wavelength spectrum. Teonex QF PEN films are capable of withstanding processing at temperatures over 180°C.

DuPont Teijin Films, https://www.dupontteijinfilms.com/

M-Speed is a chemical process supporting fabrication of high-frequency printed circuit boards. Provides low-profile innerlayer copper; delivers strong adhesion to all high-speed dielectrics. Chemicals offer cleaning, etching, and copper surface modification for optimal innerlayer bonding. Provide low-profile surface topography. Copper-to-resin adhesion and thermal resistance reportedly exceeds alternative chemical processes.

MacDermid Electronics Solutions, www.macdermid.com