ESPOO, FINLAND -- Optenni and Ansys have created a link for designing matching circuits for antennas and other RF components based on simulated 3D models. The models are simulated using Ansys' HFSS electromagnetic field simulation software.

Read more: Optenni, Ansys Offer Simulation for RF Circuit Matching

SANTA CLARA, CA – Agilent Technologies is offering a book on signal integrity characterization techniques.

Read more: Agilent Offers Signal Integrity Characterization Book

DETROIT -- SAE International will host a free telephone/webcast on Oct. 10 to clear up misunderstandings among users and to explain differences between the organization’s standards governing counterfeits.

Read more: SAE to Host Webiner on Counterfeit Parts Specs

WILSONVILLE, OR -- Mentor Graphics today announced full interoperability between the Tessent IJTAG chip-level IP integration product and Asset InterTech’s ScanWorks platform for embedded instruments, which includes chip, circuit board and system-level IJTAG tools. This combination of capabilities delivers a chip-to-system-level automated IJTAG IP integration solution said to simplify the user’s ability to leverage chip-level resources to the printed circuit board or system levels.

Read more: Mentor, Asset Master Chip-to-System IJATG Integration