ALBUQUERQUE, NM — TE Connectivity and 3D Glass Solutions are collaborating on the development of electronic interconnect devices using glass-based system-in-package (SiP) technology.
PITTSBURGH – ANSYS reported third quarter revenue of $245.9 million, up 3% year-over-year.
PROSPECT, CT – Design-2-Part (D2P) Shows have released the 2017 schedule.
SAN JOSE, CA – Cadence Design Systems reported third quarter revenue of $446 million, up 2.8% year-over-year.
DNEPROPETROVSK, UKRAINE -- Novarm has announced a call for submissions for an electronic hardware design competition based on the company's DipTrace PCB design software.
ROCHESTER, NY -- EMA Design Automation today announced the addition of the SiliconExpert component database to its PCB design portfolio.