Design News

ALBUQUERQUE, NM — TE Connectivity and 3D Glass Solutions are collaborating on the development of electronic interconnect devices using glass-based system-in-package (SiP) technology.

Read more: TE Connectivity Teams on New SiP Technology

PITTSBURGH – ANSYS reported third quarter revenue of $245.9 million, up 3% year-over-year.

Read more: ANSYS Reports Q3 Revenue Up 3%

PROSPECT, CT – Design-2-Part (D2P) Shows have released the 2017 schedule.

Read more: Design-2-Part Shows Announce 2017 Schedule

SAN JOSE, CA – Cadence Design Systems reported third quarter revenue of $446 million, up 2.8% year-over-year.  

Read more: Cadence Reports Q3 Revenue Up 2.8%

DNEPROPETROVSK, UKRAINE -- Novarm has announced a call for submissions for an electronic hardware design competition based on the company's DipTrace PCB design software.

Read more: DipTrace Opens Contest for Student Hardware Designs

ROCHESTER, NY -- EMA Design Automation today announced the addition of the SiliconExpert component database to its PCB design portfolio.

Read more: EMA Now Offers SiliconExpert Component Database

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