MILPITAS, CA – KLA Corp. formed a business group focused on growth in its electronics, packaging and components businesses. The EPC group brings together ICOS, Orbotech and SPTS Technologies to target growth opportunities in new and expanding end-markets.
CAVE CREEK, AZ – High-Density Packaging (HDP) User Group is hosting a webinar to provide the latest information on standard requirements and developments in automotive electronics. The webinar will be held June 25.
SHANGHAI –The producers of Productronica China and its related shows confirmed it will be held here as scheduled in July.
TOKYO – AGC reported first quarter electronics sales of ¥69.2 billion (US$644 million), up 16.5% year-over-year.
SANTA ANA, CA – TTM Technologies announced its board of directors has approved a restructuring plan of the company’s electromechanical business unit’s three manufacturing facilities in China.
MUNICH – Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides.