Fab News

MILPITAS, CA – KLA Corp. formed a business group focused on growth in its electronics, packaging and components businesses. The EPC group brings together ICOS, Orbotech and SPTS Technologies to target growth opportunities in new and expanding end-markets.

Read more: KLA Launches Electronics Business Group from Ex Orbotech Unit

CAVE CREEK, AZ – High-Density Packaging (HDP) User Group is hosting a webinar to provide the latest information on standard requirements and developments in automotive electronics. The webinar will be held June 25.

Read more: HDP User Group Offers Free Automotive Electronics Webinar

SHANGHAI –The producers of Productronica China and its related shows confirmed it will be held here as scheduled in July.

Read more: Productronica China to be Held in July, as Scheduled

TOKYO – AGC reported first quarter electronics sales of ¥69.2 billion (US$644 million), up 16.5% year-over-year.

Read more: AGC’s Q1 Electronics Sales Up 17%

SANTA ANA, CA – TTM Technologies announced its board of directors has approved a restructuring plan of the company’s electromechanical business unit’s three manufacturing facilities in China.

Read more: TTM to Consolidate E-M Unit in China

MUNICH – Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides.

Read more: Hensoldt, Nano Dimension 3-D Print 10-Layer PCB

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