SCHRAMBERG, GERMANY – Shareholders in Schweizer Electronic have voted to forego distribution of dividends for the company’s fiscal 2019 in order to continue expansion investments.

BANNOCKBURN, IL – IPC and High Density Package Users Group have signed a memorandum of understanding, enabling a partnership, increased technical collaboration between groups, and a mutual path toward emerging and disruptive high-density interconnect technologies.

PISCATAWAY, NJ – The 66th annual IEEE International Electron Devices Meeting will be a virtual event Dec. 12-16.

WASHINGTON – The Semiconductor Industry Association released the following statement from president and CEO John Neuffer in response to President Trump’s recent immigration executive order: