Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

ENDICOTT, NY and CHELMSFORD, UK – Endicott Interconnect Technologies Inc. (EI) has named Steve Payne director of European sales for EI Technologies UK Ltd. He will manage the newly formed UK office and oversee account penetration for specific targets within the European market. EI’s European manufacturing representatives will report directly to him.

Payne brings over 30 years of experience in the global electronic packaging industry. Prior to joining EI, he was the divisional manager for GEC Marconi Research and managing director of Cirflex Technology Ltd.

SAN JOSE, CA and OWEGO, NY – In November, Sanmina-SCI Corporation cut about 110 jobs at its printed circuit board facility in Owego, citing the dwindling economy and a slump in product demand. The layoffs included both temporary and permanent workers.

According to the New York Labor Department, the company recently cut an additional 50 jobs, leaving about 540 workers at the plant. Sanmina’s future may not be as bleak as it seems, though. The company plans to rent additional space at its manufacturing facility in Salo, Finland.

CHANDLER, AZ and FREMONT, CA – In an attempt to align output with the slumping North American market, Isola announced that it is closing its Fremont, CA facility on February 18, 2009. The company’s three remaining plants will continue to service customers.

“This is a very unfortunate event,” said Matt LaRont, president. “We have no option but to respond accordingly to what the market has done and what we think the outlook is into 2009.”

CLEVELAND, OH – OM Group announced that its electronic chemicals facility in Maple Plain, Minnesota, (the location of the printed circuit board business unit) has been named one of America's Safest Companies by EHS Today magazine.

Read more: OM Group's MN PCB Facility Named One of America's Safest

ALPHARETTA, GA – Innovative Circuits Inc. has completed an upgraded to its manufacturing facility. Improvements include new equipment to increase product throughput and improve the precision and accuracy of small-hole technology.

Read more: Innovative Circuits Upgrades Facility

ROGERS, CT and RANCHO CUCAMONGA, CA – Rogers Corp. has initiated a patent infringement complaint against Arlon Electronic Material Group of Rancho Cucamonga. The complaint is in regard to US Patent No. 5,552,210, “Ceramic Filled Composite Polymeric Electrical Substrate Material Exhibiting High Dielectric Constant and Low Thermal Coefficient of Dielectric Constant.”

Rogers is the exclusive licensee under the patent, and the complaint demands that Arlon stop the manufacture, sale and distribution of its TC-600 circuit board material. “Rogers expends substantial effort and resources to develop innovative circuit materials and protect its intellectual property rights,” explains Bob Wachob, president and CEO. “Anytime we believe our intellectual property rights have been violated we are prepared to take appropriate actions in enforcing and defending these rights.”

Arlon has received the complaint and believes the allegations are without merit. The company intends to defend itself. “We believe that this lawsuit is unfounded,” says Robert Carini, president of Arlon's Electronic Materials operations. “It is regrettable that Rogers chose to file the lawsuit before contacting us. At this point, we are in the process of retaining outside counsel and evaluating all of our legal options.”