HERNDON, VA – The International Electronics Manufacturing Initiative announced publication of Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing.
The book, published by Wiley-IEEE Press, is based on results of iNEMI’s six years of study into lead-free electronics, and covers implementation issues of Pb-free solder into board assembly, iNEMI says.
“The iNEMI book is the first practical, primary reference to cover lead-free solder assembly, as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. "Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.”
The book features chapters by industry experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, and tin whisker mitigation strategies.
The 472-page book sells for $99.95 and can be purchased through the Wiley-IEEE Press website at http://www.wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html.
The book, published by Wiley-IEEE Press, is based on results of iNEMI’s six years of study into lead-free electronics, and covers implementation issues of Pb-free solder into board assembly, iNEMI says.
“The iNEMI book is the first practical, primary reference to cover lead-free solder assembly, as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. "Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.”
The book features chapters by industry experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, and tin whisker mitigation strategies.
The 472-page book sells for $99.95 and can be purchased through the Wiley-IEEE Press website at http://www.wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html.
WYLIE, TX – Global Innovation Corp. reported earnings fell 43% on a 4.8% drop in revenues for its fiscal year ended July 31.
<!--[if !supportEmptyParas]--><!--[endif]--> The company, which fabricates printed wiring boards, reported $32.9 million in sales and net income of $6.2 million.
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ROGERS, CT – Rogers Corp. reported third-quarter net earnings from continuing operations fell 48% to $8.95 million on a 9.8% drop in net sales to $110 million. Sales exceeded company’s guidance, on strong demand for foams, high frequency circuit materials and power distribution systems, and one-time gains.
SANTA ANA, CA – The Santa Ana trade winds couldn’t slow down
TTM Technologies in the third quarter. The PWB fabricator roared to a 32% year-over-year gain in net income to $8.2 million as gross
margins rose 100 basis points to 19.2%.
SAN JOSE, CA – At the First Occam Process Developers Meeting on Oct. 17, the first three agreements for the development of the Occam process were established.
Companies committing to develop processes and work with interested OEMs to produce Occam products include microelectronics assembly company Promex Industries, PCB fabricator Micropress, and Hunter Technology Group.
Dick Otte, president of Promex stated, “We are just completing our first set of Occam process manufacturing runs … we’re excited about joining our Occam Process partners … and utilizing Occam to broaden our microelectronic assembly services.”
“We want to be the Occam Process leader in South America,” said, Gilmar Aparecido de Souza, president of Micropress, located in Sao Paulo, Brazil. “With over 2,000 customers in Brazil and throughout South America, we want to drive the Occam Process into our market … we will have our first Occam Process ‘fabsemblies’ completed within a few months.”
HELSINKI – Pertti Vuorinen, currently CFO Asia-Pacific, has been called as new CFO for the Aspocomp Group Oyj, effective today. Vuorinen held the position from 1999 to 2006.
Aspocomp Group’s current CFO, Tapio Engström, will move to a new role outside the Group.
The Aspocomp Group develops interconnection solutions and supplies PCBs for mobile data terminal equipments, data communications networks and the automotive industry.
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