AUSTIN, TX -- A local contract assembler is facing $50,000 in fines following its conviction for violating state hazardous waste laws.

Read more: Austin Board Shop Hit with Waste Dumping Fines

ENDICOTT, NY - Endicott Interconnect Technologies has appointed David W. Van Rossum chief financial officer, effective immediately.

Van Rossum is responsible for the financial plans and policies of the printed circuit board fabricator and contract assembler.

Van Rossum spent 20 years with Tyco International. He was also CFO and COO at Russound and is on the board of directors at Service Credit Union.

LONDONDERRY, NH -- Vulcan Flex Circuit has entered into an agreement to acquire printed circuit board test specialist JETI Testing.

Read more: JETI Tests Vulcan's Desire

BANNOCKBURN, IL — IPC last month released its latest technology roadmap, the biennial guide to interconnect technological trends.

The 2011 roadmap incorporates data and comparisons to help users serve clients and/or guide their companies in identifying, selecting and developing the right technology alternatives to create the products needed for future markets.

The roadmap includes expanded regional analysis and comparison. In both the substrate and assembly sections, it provides insight into the regional differences in capability between Asia, Europe and North America.

Another addition is the link of emulators to industry standards and specifications. A new section discusses the changes that need to occur in industry standards content to make them relevant to tomorrow’s needs. This includes the addition of a state-of-the-art level for product features that demand a higher degree of precision.

In areas where changes occur quickly, such as the environment, health and safety, regulations and global stewardship, the roadmap has been updated to reflect the current state and future issues.

For more information, visit www.ipc.org/roadmap.