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News

BEAVERTON, OR – Merix Corporation has announced that Steven N. Lach has joined the company as its vice president of North American Operations.

Lach previously held the position of senior VP of North American PCB Operations for Sanmina-SCI Corporation, and prior to that served as president of Photocircuits, and also held positions at Viasystems/AT&T Microelectronics and Continental Circuits, where he led the integration of Continental Circuits into HADCO. Lach holds a degree in Business Management and Finance from the University of Nevada.

Michael D. Burger, CEO of Merix, commented, "Steve has a phenomenal reputation in our industry with our vendors and with our customer base. He brings over 25 years experience in PCBs to Merix, and his considerable talent will provide great strength to our operations team."

"The PCB industry is always challenging," said Steve Lach. "Helping Merix meet the challenges and achieve its potential is a great opportunity that I couldn't pass up."

PRESTEIGNE, UK – Labtech Microwave has purchased a March PCB-1600 plasma treatment system and a Hurco VMX24 machining center at its Presteigne microwave PCB production facility.

The company states that the PCB-1600 will provide increased capability for producing Teflon and ceramic substrate PCBs with uniform blind vias, higher aspect ratio holes, and a faster removal of residual resin on the PCB surface after laser cutting. The machine’s capability to process solvent sensitive microwave PCB materials such as RO3000 and RO6000 will also help contribute to the company’s environmental impact targets.

The Hurco VMX24 machining center’s key features include a CAD/CAM interface, which the company claims will reduce lead times and improving processes, efficiency and manufacturing capability.

Commenting on the investment, Brian Popsys of Labtech Microwave said, “The new plasma machine is much more flexible to use, requires less power and fulfils Labtech Microwave’s goal of reducing our environmental impact. The Hurco VMX24 will enable more efficient production of metal-backed PCBs and boxes for component manufacture.”