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Hitachi to Produce Multilayer PCBs at Loyang Plant

Published: 18 April 2008
 by Staff
TOKYO - Hitachi has has invested approximately $28.7 million to build a 205,000 square foot printed circuit board (PCB) production facility in the company’s existing Loyang Plant in Singapore, Malaysia.

The facility will manufacture high-density, high-layer PCBs used for servers and routers, portable music players, and notebook PCs.

The company has been operating two production sites in Singapore to produce PCBs for automotive and communication market, with the company's Loyang Plant performing primarily outer layer processing, and the Bedok Plant manufacturing inner layers.

Citing the recent decline in product prices and the increase in the price of raw materials, the company has reported that they will shift their production to multilayer PCBs, where the market is expected to expand. The Loyang Plant will manufacture these boards.
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