ENDICOTT, NY – Endicott Interconnect Technologies has won a $6 million grant to develop microelectronic chips for the US military for preventing foreign tampering of weapons.

EI expects the funds, coupled with expected add-on programs, will create 27 jobs and save nearly 60 others.

The announcement was made by Rep. Maurice Hinchey (D-NY) and the company.

In a press statement, EI said the R&D program would create at least 10 jobs and retain seven others. After R&D is completed, another 17 jobs would be created for packaging development and implementation. The company expects 50 or more manufacturing positions will be retained to support production needs.

EI will work with the US Army Research, Development and Engineering Command’s Armament Research, Development and Engineering Center on the chip development.

The chips are expected to be used for unmanned ground and aerial vehicles, artillery shells, robots, satellites, and other military equipment. Use in nonmilitary applications, including laptops, PCs, smartphones and other electronics gear, is also anticipated.

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