Genesys 2021 model-based systems engineering development platform can model objects specifying attributes, parameters, and properties once, and then inherit, specialize, and extend these entities based on need.
I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management and stable power supply.
FlyPOD module connects multiple hardware resources to mini fixture installed directly on flying probe.
Electronics Packaging Designer (EPD) suites are powered by AutoCAD OEM. Used for complete PCB design or specific tasks such as bond wire exporting or translation of Gerber or GDS files.