New Products

CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating.

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CircuitWrap ink is used as bezel/wrap electrodes in touch-panel displays and micro/miniLED panels.

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CircuitShield ink is for EMI shielding and backend semiconductor metallization.

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FT230 XRF analyzer is designed to enable quality control by simplifying and accelerating testing of components and assemblies.

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Simulation 2022 software include features that help users simulate antennas and broaden users’ toolset for advanced driver-assistance systems applications.

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Metalon JG jettable gold inks reportedly feature excellent electrical and physical performance properties; ideal for applications requiring biocompatibility or high levels of corrosion resistance.

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