Ventec's tec-speed 30.0 - VT-6735 features thermal conductivity of 1.15 W/mK, providing excellent thermal performance in applications operating at elevated temperatures. Also features a low dielectric constant (Dk) of 3.5, good insulation resistance and high dimensional stability.

tec-speed 20.0 - VTM-1000i is a new hydrocarbon laminate with excellent thermal reliability and Dk of 9.8 and Df of 0.0023. Can be supplied bonded with or without a metal (aluminium or copper) base plate heat sink, and is meant for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry.

tec-speed 6.0 H-PK - VT-770/VT-770 (LK) is a halogen free and high thermal grade laminate/prepreg material that offers excellent performance in high temperature and harsh environmental applications. Offers an extended temperature range, making it reliable and resistant to thermal cycling. Features a low dielectric constant to help minimize crosstalk in high-speed signals, and is also halogen free.

tec-speed 6.0 - VT-462SH NF/LF is an ultra-low loss No Flow/Low Flow material designed to meet environmentally friendly requirements. Has good bonding and thermal performance in heat sink bonding and rigid-flex board applications, and has a small flow range with consistent lamination.

VT-4BC is a high thermal conductive metal base laminate designed for use in applications requiring excellent performance in thermal management. Features excellent mechanical properties, dimensional stability, and superior dielectric properties, and is resistant to impact, moisture, and chemicals.

Ventec

www.venteclaminates.com

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