LIOELM TCL500 / TSU 500 series low dielectric materials are said to reduce transmission losses by using an original low dielectric resin. Contribute to the widening of printed-circuit traces or narrowing gaps between lines. TCL500 consists of 25 micron low dielectric adhesive layer and release film. TSU 500 consists of 12.5 micron photoimageable film, 25 micron low dielectric adhesive layer and release film. Copper adhesion strength is 10 n/cm, Dk is 2.55 @ 1 or 5GHz, and dissipation factor is 0.006 at 1GHz and 0.004 at 5GHz.

Tokyo Ink, http://www.nagase.co.jp/display/english/pdf/fpd2014/toychem.pdf

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