LDI Strip 77 is a semiaqueous photoresist stripper for stripping very fine-line and high-density printed circuit boards.

Produces particles 2 mil. in diameter and smaller. Provides resist removal with standard dry film and LDI dry film. Contains additive package that protects metal surfaces against corrosion, including copper and tin. Enables ease of inspection at outer-layer AOI. Can be used in spray and immersion applications. Specialty additives prevent oxidation of copper; remove fine resist particles from surface. Additional inhibitors prevent tin-metal etch resist attack.

RBP Chemical Technology


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