Z-Planner v. 2018.1 PCB stackup software includes 14 new features and 12 new laminate systems.

Adds support for unlimited single-ended and differential impedance classes and functionality for mitigating glass-weave skew. Includes bidirectional Valor ODB++ support and ability to import additional PCB fabricator stackup formats. New laminate libraries are provided, including materials from EMC, ITEQ, Nanya, Panasonic, Park Electrochemical and TUC. Has automated Excel export of common material comparisons for material-selection support early in design process. Filterable parameters include dielectric constant, dissipation factor, glass-transition temperature, decomposition temperature, z-CTE, xy-CTE, and other parameters. Z-solver provides path to making what-if tradeoffs between Dk, Df, physical trace topologies, and spacing, with results including single-ended impedance, differential impedance, propagation delay, loss as a function of frequency, and effects of copper roughness. Includes HyperLynx boundary-element 2-D field solver.

Z-zero
z-zero.com

• Prev
• Next