Ultraminiature, thin-film transmission line capacitors have novel metal-insulator-metal (MIM) structure and a range of capacitance values. for high-frequency links, DC blocking in the UHF range (300MHz – 3GHz), and other high-performance microwave and RF applications.

Are developed using a high-frequency structure simulator (HFSS). Have copper traces for circuit conductivity, transmission line wire-bond pad, and gold-metallized backside ground. Come on low-loss substrates including quartz, alumina, glass, and silicon. Capacitance values range from 0.3–50pF with a ±20% tolerance. Come in standard substrate thicknesses of 0.005", 0.01" 0.015” and substrate widths of 0.020" to 0.040". Design-dependent lengths determined by transmission line dimensions; average lengths generally 0.020" –0.080" but can go beyond 0.320". Rated for up to 100V, capacitance values range from 50 to 100pF/mm2, Df is less than 0.1%, and TCC value is ±60ppm/ºC. Exhibits 50Ω standard impedance. RoHS compliant and tested to MIL-STD-883-2011.8 for bond strength, MIL-STD-883-2018 for shear strength, and MIL-STD-202-108 for lifetime. Packaging options include: antistatic waffle pack, tested but undiced, and tested and diced on tape.

AVX

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