MicroLine 5000 is for laser drilling flexible printed circuit boards. UV laser-based drill has a working area of 21" x 24". Comes in two laser power classes and is equipped with precise process monitoring systems, as well as intelligent vision systems for fiducial recognition and alignment. Performs high-speed drilling of blind vias and through-holes and is effective for contour cutting of flex PCBs. Has a laser beam spot size of 20µm. Drills and cuts delicate substrate materials with a minimal heat-affected zone. Configurable for reel-to-reel handling of flex substrates.
LPKF, www.lpkfusa.com