MILPITAS, CA –– SEMI, Cadence, Mentor, and Synopsys today announced plans to jointly develop an industry-standard protocol to combat electronic design automation (EDA) software piracy, a growing and costly problem for software vendors and their users.
Anaheim, CA – Summit Interconnect, Inc. is pleased to announce the addition of PCB and EMS industry veteran John Vaughan as Vice President of Strategic Markets.
BANNOCKBURN, Ill./ MORRISVILLE, N.C., USA, August 3, 2020 — IPC and International Electronics Manufacturing Initiative (iNEMI), have signed a Memorandum of Understanding (MoU) to collaborate and share information on developing technology roadmaps, organizing forums, establishing new programs, and identifying additional industry needs and projects for the mutual benefit of the membership of both organizations.
Atlanta, GA – ECIA’s Independent Manufacturers’ Rep Council has been very active this quarter, adding new members and making substantial progress on projects such as developing best practices for distributor training, working to improve the extract, transfer and load (ETL) process, as well as contributing to the industry-wide initiative to modernize the design registration process.
CANTON, Mass., July 28, 2020 /PRNewswire-PRWeb/ -- CHASM Advanced Materials, Inc, inventor of AgeNT™ – the leading ITO alternative for transparent printed electronics – announced today the formation of a business unit dedicated to the company's printed electronics offerings and the appointment of Daniel Skiba as vice president to lead the organization.
Atlanta, GA – ECIA’s Vice President of Industry Practices Don Elario hosted a webinar to provide updates on several important initiatives. The webinar began with a welcome from ECIA’s CEO David Loftus where he thanked ECIA member council and committee participants and provided an overview of association activities.