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Press Releases

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Category: Press Releases

Matrix USA Inc. is pleased to announce the official Trademark registration for their Lamination Assist products - EUROPADS. Designed as Printed Circuit Board Lamination Press Pads, they are manufactured to offer both heat lagging insulating characteristics as well as pressure equalization benefits.  EUROPADS proprietary elements of design is a consistent performing option for PCB Lamination optimization.

Read more: Advanced Copper Foil Inc. Granted Trademark Registration for EUROPADS

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Category: Press Releases

CONFIRMATION THAT NANO’S MATERIALS ARE NON-HAZARDOUS AND RECYCLABLE

Read more: Nano Dimension Gains RoHS 3 Certification

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Category: Press Releases

IDTechEx

Cambridge, UK

By 2030, $20Bn of the AR/VR Market Are Expected to Be Standalone-AR Devices. As a Result, Will Augmented Reality Become the Next Leader for Sports Metrics?

Read more: By 2030, $20Bn of the AR/VR Market Are Expected to Be Standalone-AR Devices. As a Result, Will...

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Category: Press Releases

5G Technology, Market and Forecasts 2020-2030

Dr Luyun Jiang, Technology Analyst at IDTechEx, has recently published the below article exploring the 5G market. This article follows the release of the IDTechEx report, "5G Technology, Market and Forecasts 2020-2030".

Read more: The Market for 5G Will Reach About $720 Billion by 2030

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Category: Press Releases

Streamlining Bills of Materials (BOM) with End-of-Life Alerts, Product Change Notifications and Obsolescence Management

Read more: Altium and IHS Markit Partner to Solve Component End-of-Life Issues for PCB Design

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Category: Press Releases

Picture a flexible circuit board (FPCB) and you will almost inevitably visualise a sheet of orange/brown plastic, probably with a few copper traces and maybe some soldered components on it. This plastic is PI (polyimide/Kapton), and its ubiquity is primarily due to its temperature resistance and general durability. Indeed, it is so durable and insensitive to temperature that PI is routinely used in laboratory ovens, cryostats, and (when laminated with aluminium) wrapped around satellites.

Read more: Flexible Hybrid Electronics: Strategies to Enable Cheaper Substrates

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