BANNOCKBURN, Ill., USA, June 30, 2020 — For the first time, the IPC Board of Directors will include an IPC student member with a full voting board seat, in response to increased student member involvement in IPC and the potential for student members, as the emerging workforce, to influence workforce development. Paige Fiet, president of the IPC Student Chapter at Michigan Technological University, was elected as the first IPC Board of Directors Student Member Liaison. The IPC Education Foundation (IPCEF) developed the nomination/election process with IPC Student Chapter advisors and every IPC Student Chapter member was eligible to vote.

Read more: IPC Announces Paige Fiet as First IPC Board of Directors Student Liaison

Schaumburg, IL.  June 26, 2020.  Bowman Chief Technology Officer Jun Choi has announced the appointment of Jeffrey Korpus as Manager of the company’s Standards Business Unit.  

Read more: Bowman Appoints Standards Manager

TEMPE, Ariz.--(BUSINESS WIRE)--What’s New: Intel is partnering with Maricopa County Community College District (MCCCD) to launch the first Intel-designed artificial intelligence (AI) associate degree program in the United States. The Arizona Commerce Authority will also provide a workforce grant of $100,000 to support the program. It will enable tens of thousands of students to land careers in high-tech, healthcare, automotive, industrial and aerospace fields.

Read more: Intel Launches First Artificial Intelligence Associate Degree Program

Atlanta, GA – ECIA’s Global Industry Practices Committee (GIPC) has taken on the task of modernizing the channel’s design registration process. Assembling a group of Subject Matter Experts (SMEs) and industry stakeholders, representing the authorized component channel, to include semiconductors, electromechanical/interconnect and passives, the group will approach the project with a multi-phase initiative to assess the current state and what the future state might look like.

Read more: ECIA Announces Industry-Wide Initiative to Modernize the Design Registration Process