Sunrise, Florida, February 2, 2021 – Nano Dimension Ltd. (Nasdaq: NNDM), an industry leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, announced today that it is has engaged CarlSquare (https://www.carlsquare.com/), in addition to Needham & Co., to advise on acquisitions in Europe.
1 February 2021 – Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that the company’s European headquarters in Leamington Spa, UK continues to maintain highest AS9100 Revision D compliance in accordance with the Aerospace Supplier Quality System Certification Scheme following successful completion of its surveillance audit.
Fast-growing Austrian company Fauna is using technology from regional high-tech company AT&S for its audio glasses.
Silicon Valley: Zero Defects International [ZDI] has recently received notice of compliance with and renewed registration for ITAR, the International Traffic in Arms Regulations.
High Density Packaging (HDP) User Group is pleased to announce that Nippon Denkai has become our newest member
CAVE CREEK, ARIZ. (PRWEB) JANUARY 21, 2021
“Nippon Denkai is excited to be a member of the HDP User Group. We look forward to learning from our member partners through the collaborative problem solving approach fostered by the HDP team. By contributing our knowledge in copper foils, we believe that our participation will assist in projects related to printed circuit board processing, reliability, and signal integrity,” said Michael Coll, COO at Denkai America.
Connectivity has always been at the core of Internet of Things (IoT) solutions. Whether tapping a local ethernet connection for Programmable Logic Controller (PLC) monitoring or deploying gateways and backhauling data over a cellular network, connectivity starts the IoT solution journey.