BANNOCKBURN, Ill., USA, April 22, 2021 — IPC announces the addition of Yusaku Kono as IPC’s Japan Representative. As IPC’s Japan Representative, Kono will lead the association’s efforts in expanding member outreach, standards development, education and advocacy support in Japan. He is based in Tokyo, Japan.
Artificial intelligence is making its way into the printed circuit board industry
Mulino, OR April 20, 2021 – Sunstone Circuits is pleased to announce the addition of Kevin Beattie to our Sunstone Management team. In his role of Quality Assurance Manager, Beattie’s 25+ year background in Printed Circuit Board manufacturing will be a tremendous asset to the Sunstone team. In addition, he brings valuable experience from his previous roles in the following areas: process engineering, new process introductions, support of nearly every manufacturing process, and extensive knowledge of Continuous Improvement, ISO, IPC and various other industry requirements. Working with production teams and leading the charge in the name of improvement is what he does well.
New Plano building will host office space, labs and manufacturing facilities for both sensors and passive components
A faster way to design and manufacture AI-enabled boards
WASHINGTON—April 12, 2021—The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders from the semiconductor industry and other sectors to discuss the global chip shortage, President Biden’s infrastructure plan, and other issues related to the semiconductor supply chain. Meeting participants included SIA board members Tom Caulfield, CEO of GlobalFoundries, Pat Gelsinger, CEO of Intel, and Sanjay Mehrotra, CEO of Micron Technology, along with senior executives from SIA member companies NXP, Samsung, and TSMC.