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  • Bend Days

    Bend Days

    A bend radius lower than the recommended minimum merits a closer look.  READ MORE...

  • The Experts' Take on AI

    The Experts' Take on AI

    What’s working now and what’s not (but should be).
      READ MORE...

  • Are You Using Too Many Vias?

    Are You Using Too Many Vias?

    The answer is probably yes.   READ MORE...

  • Designing for High-Pin Count Devices

    Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”  READ MORE...

  • PCB Stack-up and Signal Integrity Fundamentals

    PCB Stack-up and Signal Integrity Fundamentals

    How to order layers to achieve target impedance values.  READ MORE...

  • Bluetooth Design

    Bluetooth Design

    6 steps for limiting interference and data loss.  READ MORE...

  • Component Land Patterns

    Component Land Patterns

    A manufacturer’s perspective on determining parts layout.  READ MORE...

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Press Releases

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Category: Press Releases

MARKET DYNAMICS:

Market trends:

Top OSATs saw 15-20% increase in 2020 revenue compare to 2019 and 2021 is expected to shape up as a “Banner Year” for OSATs.

Total advanced packaging revenue is expected to grow at 7.9% CAGR between 2020 and 2026.

Read more: FCCSP packaging market to rise to new heights driven by mobile & consumer

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Category: Press Releases

MODUL will Enhance the Drilling/Routing Capabilities of CCI

Surrey, BC May 19, 2021 – CCI Canadian Circuits Inc., the leading manufacturer of printed circuit boards in North America, announced a new addition to their machine line-up, the Schmoll Maschinen Drilling/Routing System – MODUL.

Read more: CCI Canadian Circuits Takes Another Step Towards Smart Manufacturing with Schmoll Maschinen...

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Category: Press Releases

The German Federal Ministry for Economic Affairs and Energy (BMWI) funds the AI-based development of electronic systems and enables groundworks for the future.

Read more: Zuken joins Artificial Intelligence Research Consortium progressivKI

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Category: Press Releases

BANNOCKBURN, Ill., USA, May 20, 2021 — IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 29 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

Read more: IPC and ITI to Host Conference on Critical and Emerging Environmental Product Requirements

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Category: Press Releases

ECAD/MCAD Capability Keeps Electronic and Mechanical Designs in Sync

Read more: Altium Advances Electronic & Mechanical Co-Design

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Category: Press Releases

Sunrise, Florida, May 19, 2021 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM), an industry leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, today announced that it has sold a DragonFly LDM system for additive manufacturing of High-Performance Electronic Devices (Hi-PEDs) to the Centre national intégré du manufacturier intelligent (CNIMI). The DragonFly LDM system is the only known technology in the world that uses digital files and 3D simultaneous printing of dielectric and conductive materials to rapidly produce high performance multilayered electronic parts.  

Read more: Nano Dimension Announces Sale of DragonFly LDM to a Leading University in Quebec, Canada

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