Press Releases

Mulino, OR  April 20, 2021  – Sunstone Circuits is pleased to announce the addition of Kevin Beattie to our Sunstone Management team. In his role of Quality Assurance Manager, Beattie’s 25+ year background in Printed Circuit Board manufacturing will be a tremendous asset to the Sunstone team. In addition, he brings valuable experience from his previous roles in the following areas: process engineering, new process introductions, support of nearly every manufacturing process, and extensive knowledge of Continuous Improvement, ISO, IPC and various other industry requirements. Working with production teams and leading the charge in the name of improvement is what he does well.

Read more: Sunstone Circuits announces the appointment of Kevin Beattie as Quality Assurance Manager

New Plano building will host office space, labs and manufacturing facilities for both sensors and passive components

Read more: TT Electronics Announces Move to State of the Art Facility Near Dallas

A faster way to design and manufacture AI-enabled boards

Read more: Designing Embedded AI PCBs made Easy with Coral from Google and Upverter

WASHINGTON—April 12, 2021—The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders from the semiconductor industry and other sectors to discuss the global chip shortage, President Biden’s infrastructure plan, and other issues related to the semiconductor supply chain. Meeting participants included SIA board members Tom Caulfield, CEO of GlobalFoundries, Pat Gelsinger, CEO of Intel, and Sanjay Mehrotra, CEO of Micron Technology, along with senior executives from SIA member companies NXP, Samsung, and TSMC.

Read more: White House Chip Summit Builds Momentum for Federal Investments in U.S. Chip Manufacturing and...

NI to contribute its expertise to assessing advanced wireless research needs that will shape the future business, social and technical landscape for 6G

Read more: NI Joins the Next G Alliance to Help Build North America’s Leadership in 6G

Santa Clara, CA  April 12, 2021 – Averatek Corporation has announced FTG as an A-SAP licensee.  A-SAP is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next-generation electronics.

Read more: Averatek Announces A-SAP License Agreement with Firan Technology Group (FTG)

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