DOWNERS GROVE, ILLINOIS – November 10, 2021 – Hirose, an associate member of the Consortium for On-Board Optics (COBO), has helped create the Multi-Mode Waveguide Interconnect System (MWIS) Working Group to advance the increase of bandwidth and reduce power consumption for printed circuit board interconnect systems. The Consortium for On-Board Optics is a member-driven standards-setting organization developing specifications for interchangeable and interoperable optical modules that can be mounted onto printed circuit boards. Led by Joshua Kihong Kim, Principal Engineer at Hirose Electric, COBO's new MWIS Working Group focuses specifically on the replacement of copper traces with multi-mode waveguides and adding an extra thin interface for Electrical/Optical and Optical/Electrical conversion within close proximity to the electrical component.
LG Innotek's Gumi plant received the 'Platinum' level Zero Waste to Landfill validation
(Waterbury, CT USA) – Nov 2nd, 2021 – MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering, sintering and bonding materials, has announced a cooperation with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, on a key sinter technology for Electric Vehicle inverter assemblies, designed to significantly increase vehicle efficiency and range, and lower production costs.
Isola Group (www.isola-group.com), a global innovator in materials for printed-circuit boards (PCBs), will be showing a wide range of its wares at the upcoming Productronica 2021 exhibition. Scheduled for November 16-19, 2021, at the Messe Munchen (Munich, Germany), Productronica (www.productronica.com) is one of the world’s leading trade fairs for electronics and already offers more than 860 exhibitors for the 2021 event, which is co-located with SEMICON Europa. Isola, located at Productronica 2021 booth B3.226, will be represented by its European division, Isola GmbH.
AUSTIN, Texas, Nov. 1, 2021 /PRNewswire-PRWeb/ -- High Density Packaging (HDP) User Group is pleased to announce that Co-Tech Development (Co-Tech) has become a member.
Imaging Business Unit to upgrade its Electronic Design Environment with Zuken’s CR-8000 and DS-CR