Press Releases

MILPITAS, CA – SEMI, the industry association representing the global electronics design and manufacturing supply chain, today released the results of a survey of more than 400 U.S. member companies that highlight challenges facing the semiconductor industry. The survey results also offer insights into SEMI member perspectives on enhancing U.S. competitiveness through targeted public and private investments aimed at developing the industry’s manufacturing capacity, infrastructure and workforce. SEMI conducted the survey in partnership with MITRE Engenuity, the technology foundation for public good launched by MITRE two years ago.

Read more: SEMI Survey Highlights Member Recommendations for U.S. Chip Industry Competitiveness, Government...

PCB Supplier NCAB Group today announces the departure of Elmatica CEO Didrik Bech.

Read more: NCAB Group Announces Departure of Elmatica CEO

Former USAF Chief Software Officer to Discuss Agile and DevSecops

Read more: Zuken and Vitech Announce Nicolas Chaillan as ZIW/Integrate22 Keynote Speaker

Update to Groundbreaking 2001 Research Will Capture and Analyze Industry Transformation in Past 20 Years

Read more: ECIA and Texas A&M University Launch Major Research Project Quantifying Value of Authorized...

IDTechEx - Cambridge, UK - IDTechEx Discuss the 5G Materials Battle: Sub-6 GHz vs mmWave

Read more: IDTechEx Discuss the 5G Materials Battle: Sub-6 GHz vs mmWave

Austin, Texas February 10, 2022. High Density Packaging (HDP) User Group is pleased to announce that industry expert Dr. Bev Christian, HDP Facilitator, has been awarded the Dieter Bergman IPC Fellowship Award.

Read more: Dr. Bev Christian wins the Dieter Bergman IPC Fellowship Award

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