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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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Press Releases

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Category: Press Releases

Isola Group a global leader in circuit materials and materials technologies, is pleased to announce the hiring of Jim Francey as RF Business Development Director, Europe. Jim will report directly to David Humby, Vice President Sales and OEM Marketing Europe, in the new role and will apply his industry background and considerable experience in the RF/microwave electronics industry to help Isola explore and expand new opportunities for high-frequency circuit materials within printed-circuit boards (PCBs) in such applications as Fifth Generation (5G) cellular wireless equipment and autonomous (“self-driving”) vehicles.

Read more: James Francey Joins Isola Group as RF Business Development Director, Europe

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Heilind Electronics will increase the international availability of Tech Etch’s Products

Read more: Tech Etch Announces Expanded Distribution Partnership in Europe

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Co-Founder Stephen Collins to Continue to Serve on Board of Directors

Read more: Waugh Brings Proven Track Record Driving Rapid Cloud-SaaS Revenue Growth

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Category: Press Releases

The new audio modules will compete with current TWS products with up to 75% reduced size, up to 85% reduced weight, and improved sound quality.

Read more: USound and AT&S Revolutionize the True Wireless Earbud Market With MEMS-based Fully Integrated...

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BANNOCKBURN, Ill., USA, March 1, 2022 — During his State of the Union address tonight, U.S. President Joe Biden is expected to urge Congress to pass much-needed funding for semiconductor manufacturing and other advanced technologies as part of a new competitiveness measure. Both the House- and Senate-passed bills include $52 billion in funding as well as additional measures to boost American R&D, which will help reestablish the United States as a global leader in building the technologies of the future. IPC applauds President Biden’s continued focus on the semiconductor shortage and his ongoing efforts with Congress to finalize the “USICA/America COMPETES” legislation.

Read more: IPC Applauds Biden’s Focus on Semiconductors, Urges Passage of Competitiveness Legislation

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Category: Press Releases

Independent certification reinforces Altium’s commitment to ensuring data availability, security, and privacy

Read more: Altium Announces Completion of SOC 2 Type 1 Certification for Altium 365

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