BANNOCKBURN, Ill., USA, June 17, 2022 – Three top industry organizations this week urged U.S. Congress to support legislation that would address challenges confronting the U.S. electronics supply chain.
Ucamco has added the in-house production, from scratch, of new large and extra large format laser photoplotters to its capabilities.
Chandler, Ariz., June 14, 2022 – Rogers Corporation (NYSE:ROG) has announced that Technical Marketing Manager, John Coonrod, will give 3 presentations on June 21st in the MicroApps Theater at the International Microwave Symposium (IMS) in Denver. His topics will include “Radix 3D Printable Dielectrics & Lens Demonstrator”, “An Overview of Copper Foil: How It's Made, Roughness Effects & RF/ HSD Influences”, and “How to Get Consistent Millimeter-Wave Performance Using Grounded Coplanar Waveguide.”
Cranston, Rhode Island, USA – Technic is pleased to announce that Mike Carano has joined the company as a consultant for the PWB market segment. Mike will be responsible for helping Technic secure OEM and fabricator approval for our final finish products.
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS):
What:
Keysight will be participating at the IEEE MTT-S International Microwave Symposium (IMS), the world largest gathering of microwave and RF professionals.
When:
June 19 – 24, 2022
Where:
Denver - Colorado Convention Center
Booth: 7030
Represents an unparalleled success story in the Printed Circuit Board (PCB) and Package Substrate markets
Plater is used for application in one of the most dynamic and fastest growing segments in the PCB market
BERLIN: Atotech, a market leader in advanced electroplating solutions, announced today the sale of its 1,000th horizontal equipment for electrolytic copper plating. The plater, which belongs to the company’s Uniplate product family, will be installed at one of Taiwan’s leading advanced package-substrate and PCB manufacturers. Atotech’s Uniplate Cu18 plating line is designed for high aspect-ratio through-hole filling of core layers for advanced packaging of CPU and MPU for high-performance processing and computing.