Press Releases

December 15, 2021.  Uyemura, a world leader in specialty surface technologies, has announced a landmark expansion of its senior leadership team.

Read more: Uyemura Expands Senior Leadership Team

New interface connects wiring and PCB design data and metadata with SAP’s ERP system

Read more: SAP Certifies Zuken Interface for S/4HANA

[December 13, 2021: Irving, TX] Epec Engineered Technologies announced today that it has invested more than $1M in new equipment at its NetVia Group PCB manufacturing facility located outside of Dallas, Texas.

Specifically, they have added an Orbotech Dimension 6 AOI with Microvia inspection capability, a Mivatek 200L LED laser direct imaging system, a Miocrocraft EMMA Flying probe electrical tester with 1000V HiPot testing capability, along with several of the newest high-end metallurgical microscopes and an automatic metallographic grinding and polishing machine to dramatically improve throughput in our laboratory.

“Since the acquisition of NetVia by Epec Engineered Technologies in November of 2020, the growth of our business has required that we increase our capacity and our equipment resilience to ensure that we can meet our customers’ delivery and technology needs. We are dedicated to ensuring that we can manufacture high-technology rigid circuit boards and rigid-flex PCBs for our customers, which will require us to increase our equipment in terms of capacity and capability every year,” stated Ed McMahon, CEO of Epec Engineered Technologies.

The equipment that has been installed is the highest technology available in terms of speed and accuracy which increases NetVia’s ability to manufacturer PCB with 3/3 lines and spaces, thousands of test points per part, and ensuring that PCBs with even the smallest microvias are inspected using machine technology.

Jeff Forbus, President of NetVia, said: “Our team is dedicated to our customer success and with the addition of this equipment we can now move even faster to help our customers get their product to market faster. Printed circuit boards require a constant focus and attention to detail and these additions are going to help us with both.”

 

About NetVia Group

NetVia Group is a manufacturer of high-reliability, advanced circuit technology. For over 35 years, the most advanced and innovative technology companies have relied on NetVia Group for all of their time-critical, high-performance PCB solutions.

About Epec Engineered Technologies

Epec is one of the fastest-growing high technology electronics companies in North America, designing and manufacturing high-reliability products including printed circuit boards, custom battery packs, user interfaces, RF products, cable assemblies, and flexible heaters for OEMs around the world.

(Waterbury, CT USA) – December 13, 2021 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.

Read more: MacDermid Alpha to Exhibit and Present at TPCA and IMPACT

Silicon Valley:  Zero Defects International [ZDI]  has announced the renewed and improved availability of printed circuit board assembly reverse engineering services. This is in addition to their ongoing flying-probe testing. Companies requiring legacy PCBAs which had been originally made even decades ago can use ZDI to generate and deliver the data needed to manufacture a product with the same functionality as the original.

Read more: ZDI enhances REVERSE ENGINEERING and failure analysis SERVICES

Isola Group, a global innovator in materials for printed-circuit boards (PCBs), has announced its low-loss I-Tera® MT40 circuit materials supporting multilayer printed circuit boards (PCBs) for military- and commercial-grade low-Earth-orbit (LEO) satellites. The laminates and prepreg materials are suitable for high-density-interconnect (HDI) multilayer assemblies that must meet demanding military size, weight, and power (SWaP) requirements for LEO satellite payloads. The circuit materials are available in the form of I-Tera MT40 laminates and prepreg materials for high-speed-digital (HSD) circuit applications and I-Tera MT40 (RF/MW) laminates for high-frequency RF and microwave (MW) circuits through W-band frequencies.

Read more: Isola Materials Support Military LEO Satellites

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