06 September 2022 - Ventec International Group Co., Ltd. (6672 TT), will be exhibiting at electronica India 2022 at the India Expo Mart in Greater Noida. From 21 to 23 September 2022, visitors to Ventec’s booth EP12 in the IPCA Expo area (Hall 12) will be invited to discover the company’s unique laminate & prepreg capability across a very wide range of applications and budgets - all supported by a fast and efficient global delivery promise through Ventec's fully controlled and managed global supply chain and world-class dependable technical support.

The key focus on Ventec’s booth EP12 will be:

tec-speed: Ventec’s comprehensive and enhanced set of high-performance, high-reliability high-speed/low-loss/high-frequency solutions, including:

tec-speed 30.0 - Ventec’s latest ceramic filled high-speed/high-frequency PTFE material range that offers the highest signal-integrity characteristics for the most advanced high-frequency systems such as 77~79 GHz automotive radar systems.

tec-speed 20.0 - Few substrate materials can match the high-speed signal-handling performance of this ceramic-filled hydrocarbon thermoset material series. tec-speed 20.0 combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and highest reliability particularly demanded by automotive and 5G applications.

tec-speed 6.0 - High-speed, high-frequency material technology for applications requiring great signal integrity and low-Dk benefits with high reliability. Ventec’s material formula also features high Conductive Anodic Filament (CAF) resistance to offer highest assurance of reliability in humid environments.

tec-thermal: Ventec's IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs, leverage innovative formulas for excellent thermal performance. Highlights include:

VT-4B5 SP - an aluminum base laminate that ensures maximum thermal efficiency for direct-to-metal connections of electrically isolated heat sources and places dielectric insulation only where needed.

VT-4B5L - a high-performance IMS material that offers excellent solder joint reliability and thermal conductivity of 3.6 W/mK.

autolam: a PCB base material solutions set specifically curated for the diverse and unique requirements of automotive applications. Highlights include:

VT-4B5H - a metal base laminate material with high Tg (180oC) and thermal conductivity of 4.2 W/mK, ideally suited for applications such as LED lighting, power conversion, monitor drives and power supply.

VT-4B7 - a high-performance IMS material for applications where maximum thermal conductivity and electrical performance are key. Specified at 7.0 W/mK, VT-4B7 is an affordably priced substrate that competes strongly with direct-bond copper (DBC).

“India is a market with huge growth potential for Ventec. Together with CBC PCB, our distributing partner for India, we're incredibly excited to be exhibiting at electronica India for the first time and can't wait to share our expertise and knowledge with the many visitors to the show,” said Chris Hanson, VP IMS Technology.

Ventec International is a world leader in the production of polyimide & high-reliability epoxy laminates and prepregs and a specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.

About Ventec International Group

Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper-clad glass reinforced and metal-backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology, and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support network. For more information, visit www.venteclaminates.com.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

VAL-DE-REUIL, September 5th, 2022 -- Altix is delighted to deepen their ties with Elcoflex, a European pioneer in Roll-to-Roll production based in Finland. Their latest development efforts are targeted to mass produced IoT devices such as Smart Labels, Printed Batteries and Supercapacitors.

This new AcuReel unit will focus on dry film and soldermask exposure using Altix’s latest OmniLight™ HR light source. The machine will boast the latest endless stitching function and will be capable of double-sided registration prior to soldermask exposure. Moreover, the system’s tailor-made unwinder and winder pair is entirely designed & manufactured by Altix in France.

‘This latest purchase order is of the utmost importance to us’ underlines Alexis Guilbert, Altix Sales & Product Manager. ‘A roll-to-roll specialist such as Elcoflex renewing their trust in us is a testament to our RtR exposure capabilities’.

‘Altix's ability to meet our special requirements and understanding the challenges of roll-to-roll exposure were the main factors in deciding to purchase the newest line from them.’ says Timo Peltoniemi, Managing Director of Elcoflex.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Isola Group has long been a supplier of high-performance circuit materials for both high-frequency RF/microwave and high-speed-digital (HSD) circuits. And, as visitors to the upcoming 2022 European Microwave (EuMW) Exhibition will find out, those different materials can be processed at the same temperatures and with similar manufacturing methods, making them ideal candidates for mixed-signal, hybrid circuits of the future, combining RF/microwave and digital circuits at the highest frequencies and speeds. These hybrid circuit solutions can be designed and manufactured as compact, multilayer circuit assemblies to fit the tightest space requirements while achieving the most challenging electrical, mechanical, and environmental requirements.

The 2022 EuMW Conference & Exhibition is scheduled for September 25-30, 2022, at the Milano Convention Centre in Milan, Italy, as part of European Microwave Week. Visitors to Milan can partake in state-of-the-art technical presentations, educational workshops, and an exhibition floor expected to draw thousands of potential customers. Visitors to Booth F24 can learn about Isola Group’s line-up of high-performance circuit materials, including Astra® MT77, I-Tera® MT40, Tachyon® 100G, and TerraGreen® 400G.

Astra® MT77 is an excellent starting point for many RF/microwave circuits. It features a dielectric constant (Dk) which is stable with temperature, typically 3.00 in the z-axis (thickness) measured at 2 and 10 GHz. It offers among the lowest loss available in a microwave circuit material, with dissipation factor (Df) of 0.0017 at both 2 and 10 GHz.

I-Tera® MT40, with a Dk of 3.45 at 2 and 10 GHz, has Df of 0.0031 at 2 and 10 GHz. It is a robust substrate for HSD circuits and can be tailored to RF/microwave circuits as I-Tera® MT40 (RF/MW), with Dk from 3.38 to 3.75 at 2 and 10 GHz and Df from 0.0028 to 0.0035. The two materials deliver stable thermal performance with similar characteristics, including the same glass transition temperature (+200°C), to invite combination in production processes for mixed-signal circuits.

Visitors to the Isola Group booth (Booth F24) at the 2022 EuMW Exhibition can also explore the outstanding HSD circuit characteristics of Tachyon® 100G and the low-loss capabilities of TerraGreen® 400G for RF/microwave and HSD circuits in halogen-free applications. Tachyon® 100G, with a Tg of +200°C, maintains Dk consistent with frequency: 3.04 at 2 GHz dropping slightly to 3.02 at 10 GHz. Its loss is extremely low, with Df of 0.0021 at both 2 and 10 GHz. Halogen-free TerraGreen® 400G materials have a slightly higher Tg than the other materials, at +210°C. They are RoHS-compliant for lead-free processing and are well suited for mmWave circuits to 110 GHz and beyond.

Isola Group’s representatives will be on hand at the 2022 EuMW Exhibition to offer insights into the use of their circuit materials and to review manufacturing methods that can lead to cost-effective mixed-signal, multilayer circuits that combine RF, microwave, HSD, even millimeter-wave (mmWave) circuits at least through 110 GHz based on their circuit materials. Available as laminates with wide ranges of copper weights and as prepregs without metallization, the circuit materials provide the electrical, mechanical, and environmental performance levels needed for commercial, industrial, military, and space applications over wide operating temperatures (-55 to +125°C) with the ease of processing compatible with materials such as FR-4 to achieve the most practical, cost-effective hybrid circuit solutions combining high-frequency, high-speed circuits. For more information about any of these materials, please visit the Isola website at www.isola-group.com.

About Isola

Isola Group is a leading global developer and supplier of advanced electronic circuit materials for high-voltage, high-power, high-speed, and high-frequency PCBs. By performing ongoing R & D on emerging circuit applications, such as military radar and EW systems, commercial 5G communications networks, and vehicle electronification, and operating a network of global factories, Isola provides cost-effective, high-performance solutions for the most challenging electronic single-layer and multilayer PCB applications.

(Waterbury, CT USA) – September 1st, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Semiconductor and Assembly Solutions that provides unmatched capabilities in electronics design and manufacturing, will exhibit its total process solutions for the emerging semiconductor market at Semicon Taiwan, Taipei City, September 14-16, 2022 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).

Featured will be the entire portfolio of technologies from the Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone brands that enable end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry.

“Increasing component density, finer pitch and thermal management are critical to advanced package technology evolution.” explains Marc Lin, Taiwan Sales Director at MacDermid Alpha. “Our broad offerings from wafer level plating, packaging and assembly technologies bring unique solutions to support our customers. Our mission is to advance their process/device capability and reliability. “

Clare Wang & Tim Guo, Technical Lead & Technical Engineer, MacDermid Alpha Power Semiconductor & Discrete Packages team‬ will present at the ‘TechXPOT’ section on ‘Enabling Efficient 5G Device Packaging with Novel Hybrid Silver Sintering Die Attach Technology’. Wang and Guo will discuss the significant increase in demand for high thermal attach materials in 5G infrastructure and communication devices. To meet this demand, MacDermid Alpha has developed a novel silver sintering die attach technology – ATROX 800HT series. ATROX 800HT series provides extremely high electrical and thermal conductivity, increased reliability, and enables drop-in compatibility for high volume manufacturing (HVM) of high power 5G devices.

MacDermid Alpha’s team of industry experts will be available at Hall 1 Booth # L0500 to discuss advanced technology offerings. For more information on MacDermid Alpha’s semiconductor chemistries and assembly materials please visit MacDermidAlpha.com.

About MacDermid Alpha Electronics Solutions:

MacDermid Alpha Electronics Solutions enables electronics interconnection through the innovative specialty chemicals and materials from our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands. We serve all global regions and all steps of device manufacturing within every segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the implementation of new technologies that redefine what is possible in device design. Our world class technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable electronics innovation.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com