Trackwise of Tewkesbury, the PCB-based products developer, is building a high volume plant for one of their key battery sub-systems – the cell-to-pack interconnect.

Read more: Trackwise to increase cell-to-pack interconnection volumes

Committee Awards presented at IPC SummerCom 2022

BANNOCKBURN, Ill., USA, May 12, 2022 — IPC presented Committee Leadership and Distinguished Committee Service Awards on May 9 at IPC’s SummerCom Standards Development Committee Meetings in Milwaukee, Wis. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.

Read more: Volunteers Honored for Contributions to IPC and the Electronics Industry

Robert Art - Ventec to host live Webinar on Thermal Management with IMSMay 12, 2022 – Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that it will be hosting a live webinar on ‘Top design techniques for thermal management with IMS’ on Thursday, 23rd June at 3 pm CET / 9 am EST. Presented by IMS technology expert Robert Art, the webinar is geared towards helping PCB Designers, OEMs and PCB Manufacturers optimize the thermal performance, reliability, and quality of their designs with high performance IMS materials.  

Read more: Ventec to host live Webinar on Thermal Management with IMS

Heraeus Electronics today announced that Bastian Schlüter, Global Product Manager Metal Ceramic Substrates, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, “Al2O3, ZTA, AMB and What’s Next?” is scheduled to take place May 11, 2022 at 12:50 p.m.

Read more: Heraeus Electronics to Present “Al2O3, ZTA, AMB and What’s Next?” at PCIM Europe