WILMINGTON Del., September 22, 2022 – DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced today a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.

Integrating Pyralux® AP copper clad laminate into eMPack® traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. The characteristics of Pyralux® AP benefiting this application from Semikron-Danfoss include:

• Robust thermal resistance for temperature stability

• All-polyimide dielectric layer

• Extreme durability

• Excellent bond strength for automotive-grade reliability

• Excellent low dissipation loss characteristics

• Superior electrical performance

• Consistent signal integrity

Further, Pyralux® AP’s dielectric thickness tolerance and low coefficient of thermal expansion make it ideal for rigid flex or multiple layer flex applications. The adhesive-less flexible circuit material has a flammability rating of UL 94-V0, a maximum operating temperature of 200°C, and is certified to IPC 4204A/11.

"Pyralux® AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack® is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux® technology to help eMPack® become a global leader in EV power modules.”

Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack® power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD).

“We are excited how this EV power module application of Pyralux® AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack® power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack® and appreciate the collaboration with Semikron-Danfoss.”

About DuPont Electronics & Industrial

DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products, and technical service to enable next-generation technologies.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

BANNOCKBURN, Ill., USA, September 21, 2022 – IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper-clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully re-qualified their products to IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. TUC first achieved QPL status five years ago for 18 products covering IPC specification sheets 102, 126, 130 and 134.

TUC met or exceeded the IPCs Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.

“In the 1970s, 1980s, and 1990s, having a product posted on the Qualified Product List (QPL) for the USA Military Standard MIL-S-13949 meant that the company met the highest standards for production and quality,” said George Hsin, chief strategy officer, Taiwan Union Technology Corporation. “PWB suppliers made this QPL their first screen when selecting base materials. The facilities and the products on the QPL were trusted by the entire electronics supply chain. At TUC, we were happy to see the QPL concept brought back by IPC five years ago to their base materials standard IPC-4101. TUC is also excited to be the first copper-clad laminate and prepreg manufacturer in the world to pass the qualification testing program at an independent test laboratory for a second time.”

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes that conform to IPC standards.

“TUC has differentiated itself from the competition by demonstrating its commitment to the highest level of quality,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize TUC as a member of the trusted IPC-4101 QPL suppliers.”

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

BANNOCKBURN, Ill., USA, September 21, 2022 – The electronics industry is calling on U.S. President Joe Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act by prioritizing domestic development of printed circuit boards (PCBs) and integrated circuit (IC) substrates under Title III of the Defense Production Act.

Three industry groups – IPC, the U.S. Partnership for Assured Electronics (USPAE), and the Printed Circuit Board Association of America (PCBAA) – delivered a letter to President Biden, calling on him to issue a presidential determination on the matter.

“For more than 20 years,” the letter states, “experts in and out of government have warned that the erosion of U.S. PCB capabilities and capacity would compromise national and economic security. These warnings have proven all too accurate, as today, the U.S. share of global PCB production has fallen from 30 percent to 4 percent, making the nation precariously reliant on a global supply chain that is itself in turmoil.”

The Biden administration’s year-long assessment of the information and communications technology (ICT) supply chain highlighted the critical importance of PCB fabrication and assembly in electronics manufacturing and recommended that government programs like Title III be used to bolster the strength of U.S. PCB manufacturers.

Supporting the entire electronics ecosystem is also “critically important to the implementation of the CHIPS Act,” the letter continues. “Presently, there are no U.S. manufacturers that can produce the volume of IC substrates needed to support defense and commercial needs.” Increasing domestic chips production without bolstering regional development and manufacture of cutting-edge PCBs and IC substrates risks lengthening and slowing the semiconductor supply chain, because many of the chips made in Arizona or Ohio will need to be sent to other countries for component packaging and assembly into finished products.

“A presidential determination on PCBs and IC substrates would be a key step toward rebuilding the U.S. electronics manufacturing industry,” Mitchell added. “The Executive Branch and Congress must continue to support – through long-term policy and funding – the entire ecosystem that drives and sustains innovative, resilient, and secure electronics manufacturing.”

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

EXTON, Pa., September 20, 2022 – AGC Chemicals Americas Inc. (AGCCA) has opened a new office in Cupertino, California, to support the advanced materials needs of semiconductor and electronics manufacturers located on the northern West Coast.

The Business Development Office Chemicals (BDOC) will enable the company to enhance customer relationships, create partnerships and increase its involvement with technology associations and organizations.

Led by Ichiro Yamanouchi, new market development director, presence in the region will also enable AGCCA to directly inform stakeholders in semiconductor and electronics development about the company’s innovative sustainable solutions.

The Cupertino office promotes a wide variety of advanced materials including:

• ETFE and PFA resins for tubes, hoses, gaskets and sheets;

• ETFE films for mold release film; and

• Fluoroelastomers for components used in semiconductor plasma processes at elevated temperatures.

Other products offered are:

• Amorphous fluoropolymers for optics and semiconductors;

• Adhesive fluoropolymers to chemically bond with polymers, metals and printed circuit boards;

• Environmentally friendly cleaning agents for electronics; and

• Ionomer dispersion grades for hydrogen fuel cells in fuel cell vehicles.

“Our advanced materials help semiconductor and electronics manufacturers create products that can hold up in the harshest conditions,” said Yamanouchi. “Our presence in this region will enable us to better assist semiconductor and electronics manufacturers with selecting and using the most cost-effective product for their specific applications.”

The new office is located at 19200 Stevens Creek Blvd, Suite 230, Cupertino, CA 95014, where AGC Business Development Americas (ABDA) also has an office. For more information about AGCCA’s new location, contact Ichiro Yamanouchi at This email address is being protected from spambots. You need JavaScript enabled to view it..

About AGC Chemicals Americas Inc.

AGC Chemicals Americas is a global subsidiary of AGC Inc., a multinational corporation and one of the world’s largest manufacturers of glass, electronic displays and chemical products. Headquartered in Exton, Pennsylvania, including a state-of-the-art technology center, AGC Chemicals Americas maintains manufacturing operations in nearby Thorndale, Pennsylvania, a satellite sales office in Guaratinguetá, Brazil, and warehouses located throughout North America. www.agcchem.com