Austin, Texas November 8, 2022. High Density Packaging (HDP) User Group is pleased to announce that Mitsui Mining & Smelting Co., LTD. (Mitsui Kinzoku) has become a member.
Mitsui Kinzoku has been contributing to worldwide society by providing various valuable products. One of those products is copper foil. The company focuses primarily on high-end applications in each electronics field, such as advanced packaging and high-speed communications. The company expects that their materials knowledge will be utilized in several HDP projects.
“I am pleased to welcome Mitsui Kinzoku to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in high-performance copper foil, especially for high-frequency and high-speed applications, will contribute significantly to several of our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
Visit Mitsui Kinzoku at https://www.mitsui-kinzoku.com/
About HDP
HDP User Group (www.hdpug.org), a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Tokyo.
For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Madan Jagernauth at This email address is being protected from spambots. You need JavaScript enabled to view it., phone number +1 561.501.1567.
LONDON – November 08, 2022– nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection, today announced it will preview its upcoming digital manufacturing software portfolio at Rockwell Automation Fair in Chicago. The Design to Manufacturing Software, powered by Zuken’s E3.series, is a proven and fast engineering system for designers and manufacturing personnel to:
• Plan and design the electrical engineering for machines and factory systems
• Automate panel building through 2D/3D design and assembly of industrial and commercial control panels
nVent is a global leader in providing industrial enclosures, and advanced cooling solutions, and a has comprehensive machine portfolio to automate panel building. The Design to Manufacturing Software solution by nVent HOFFMAN, powered by Zuken, helps us to create time and labor savings which enables us to build a more sustainable and electrified world.
“By adding the Design to Manufacturing Software solution, powered by Zuken, we have significantly enhanced our value proposition by optimizing the entire panel design and fabrication process,” said Alexander van der Weide, general manager and vice president for nVent. “Companies are prudently finding ways to maximize the skills of their workforce, especially in such a competitive landscape and tight job market. This will make it easier for our customers to deliver high-quality solutions faster, with fewer resources and time-consuming steps.”
We simplify design. We connect engineering to manufacturing.
• We simplify design
• We connect engineering to manufacturing
• We capture and deploy knowledge
• We solve the shortage of engineers and skilled labor
• We accelerate profitable growth
The Design to Manufacturing Software provides design automation to help electrical engineers to simplify processes, and ultimately increase overall productivity. With its easy-to-use intelligent central parts library, designers can now efficiently work on a single project while the software automatically ensures the data is continually up to date, making the design and planning process easy.
The optimized engineering process drives the creation of the digital twin with all the necessary manufacturing details. We automate the panel building process by connecting machines and workers, accelerating the transition to smart manufacturing. Workers can now easily visualize the design and immediately access digital documentation. This automated workflow detects critical errors and significantly improves the time to build a panel, and maintain the overall process.
The advanced software portfolio will be released in 2023 as part of a collaboration with Zuken, a leading global software company specializing in optimizing electrical and electronic engineering design processes. The Design to Manufacturing software portfolio will include specially designed software packages for engineering and manufacturing processes, connecting workers to the manufacturing floor, and adding optional add-on functionalities.
Visit us in Booth 149
There will be demonstrations of the Design to Manufacturing software each hour in Booth 149 at Automation Fair in Chicago November 16-17.
About nVent
nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high performance products and solutions that connect and protect some of the world's most sensitive equipment, buildings and critical processes. We offer a comprehensive range of enclosures, electrical connections and fastening and thermal management solutions across industry-leading brands that are recognized globally for quality, reliability and innovation. Our principal office is in London and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, RAYCHEM, SCHROFF and TRACER. Learn more at www.nvent.com.
nVent, CADDY, ERICO, HOFFMAN, RAYCHEM, SCHROFF and TRACER are trademarks owned or licensed by nVent Services GmbH or its affiliates.
About Zuken
Zuken is a global software company providing industry leading electrical and electronic design solutions. Founded in 1976, Zuken has a long track record of technology innovation and financial stability in the electronic design automation (EDA) industry. With a product portfolio of world-class design solutions spanning MBSE-based product definition and services to electrical and electronic design solutions to address the needs of a broad range of industries across the globe. These design solutions provide our customers with improved productivity and efficiencies in this highly competitive landscape. For more information about the company and its products, visit www.zuken.com.
WEST CHICAGO, IL — Anaya Vardya, President, and CEO of American Standard Circuits, has recently appointed industry veteran Robert Duke as head of ASC's new Global Sourcing Division.
Bob Duke is an industry leader in global supply chain management. At his most recent position as a vice president and managing partner for M-Wave Controls L.L.C. he was responsible for global sourcing of critical electronics parts and components. He brings knowledge, experience, and networking to ASC as he assumes leadership of the new division.
Mr. Vardya stated, “We are excited to have Bob join the ASC team. HIs vast amounts of global sourcing knowledge and experience make him the perfect candidate to lead the global sourcing division. Although we have been sourcing PCBs from all over the world for several years, we will now expand our offerings to included sourcing of other products including cable and wire harnesses, plastic and metal fabrication products, batteries, magnetics and more. I am certain that with his successful background in sourcing products from all over the world, Bob is the right person to lead the division into a successful future.”
Added Mr. Duke, “ I am thrilled to now be a part of the American Standard team. I have watched with admiration as ASC has evolved and grown over the past few years and now, I am proud to be able to say that I am part of that winning team. I’m ready to take on this new and exciting opportunity.”
Robert Duke has been involved in the electronics industry since the mid 70’s. He worked for various PCB manufacturers in the early days of his career and migrated to electronic component distribution and supply chain services prior to co-owning a PCB assembly company that had operations in the US and China. His present position is vice president/managing partner of M-Wave Controls, LLC based in Aurora, Illinois. MWC designs and manufactures custom controls for food service equipment and various other industries requiring these services. He has also held the position of general manager at Hamilton Hallmark (div. Avnet Electronics) in Chicago where he gained a great deal of experience in electronic component distribution.
FOUNTAIN INN, SC – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is introducing a new global MLCC part numbering system this November.
The new global MLCC part numbering system will maximize manufacturing synergies within KYOCERA AVX and the KYOCERA Electronics Components Group, which combined their MLCC manufacturing and development resources in 2021 following the corporate reorganization and rebranding that elicited KYOCERA AVX. It will also facilitate the rapid expansion of the MLCC business unit and make it easier for customers to perform product searches across the entire KYOCERA AVX brand portfolio.
“The new MLCC part numbering system will be introduced this November, starting with new product releases. Our goal is to make it the universally preferred ordering code for all KYOCERA AVX MLCC products while providing customers with adequate time to familiarize themselves with the new part numbers,” said Neil Smyth, Marketing Director, KYOCERA AVX. “We’re excited about this important milestone of our MLCC product line integration. Also, I’d like to emphasize that all of the KYOCERA AVX MLCCs that employ the new part numbering system will continue to be produced with the same trusted materials, designs, and processes and exhibit the same physical and electrical characteristics.”
HERTFORDSHIRE, UK — The eighteenth annual survey of tin users carried out by the International Tin Association (ITA) estimated that refined tin use in 2021 increased 7.6% to 389,500 tonnes with a strong recovery to pre-trade war highs.
However, estimates showed expected 2022 growth stalling below previous forecasts of 3-4% towards -0.6%. High inflation unexpectedly impacted demand in H2.
One hundred twenty-eight companies took part in this year’s study, accounting for some 46% of estimated global refined tin use in 2021.
Provisional estimates of total global tin use, including refined and unrefined forms, totalled 436,100 tonnes in 2021, up 3.9% from 2020. The Recycling Input Rate (RIR) was calculated to be 28.2% in 2021 and is forecast to increase slightly to 28.5% in 2022.
Refined tin stocks held by surveyed companies at the end of 2021 amounted to the equivalent of 2.7 weeks’ supply. Extrapolating to global consumption implies that world consumer stock holdings were around 20,400 tonnes. Consumer stocks were lower through much of 2021, but more ample supply towards the end of the year enabled a recovery, giving a net slight decrease from 2.9 weeks in 2020. Forecasts for 2022 suggest that consumers are looking to destock as demand falters; held stock is forecast to fall to an estimated 2.2 weeks’ supply.
Solder still accounts for the largest global share of tin use, increasing slightly to 49% in 2021. Global average growth of refined tin use in this sector was 12.2%. 2022 forecasts reflect the impact of inflation on consumer segments: an average decrease of -3.7% is expected globally, with a larger effect in China. Solar ribbon now represents 10% of solder production and is emerging as a major new use. Respondents are still optimistic about longer-term prospects for increased use in solar, 5G, electric vehicles, and other new technologies.
The average proportion of lead-free solders in electronics grew to 86% globally in 2021, up from 80% in 2020. 65% of tin use globally in lead-free solders was specified at < 100ppm Pb, down from 82%. The trend toward higher-purity, lower-lead specifications in tinplate continued in 2021, as 95% of refined tin specified by reporting participants was < 50ppm Pb, a marked shift from 79% in 2020.
In chemicals, tin use by survey participants increased by 4.0% in 2021 and was forecast to grow by 4.9% in 2022. Market dynamics in this sector have been complex through the pandemic, with both positive and negative effects in different sectors. This data reflects broad recoveries continuing through 2022, with China markets weakened by its ongoing property crisis.
Pandemic-boosted tin use growth in tinplate markets continued through 2021 at 5.2%. Participants forecasted this higher baseline to be maintained with a modest 0.3% growth in 2022. Some turbulence can be expected with both positive and negative effects possible in relation to forecasted food market disruption.
Lead-acid battery tin use markets reflected a significant pandemic boost to e-bike use in China as well as some recovery in auto markets, growing by 6.9% in 2021 and forecast at 7.6% growth in 2022. Tin intensity increases in start-stop hybrid vehicles and other advanced batteries are also supporting growth. Markets will continue to grow steadily in the medium-term despite ongoing development of lithium-ion and other technologies.
Tin use in tin-copper markets increased significantly in 2021, with global growth of 15.8% reflecting pandemic recovery supported by new technology markets including electric vehicles and new electrical infrastructures. Negative growth forecasts for 2022 at -9.2% are mainly based on the cost-of-living crisis. Other traditional metal product markets averaged a -4.4% decline in 2021, largely rebalancing a large 2020 boost from float glass installations in China. Outside of China, markets showed some recovery. Markets are expected to resume a steady 1.2% growth in 2022. More information about tin use is available on the ITA website: www.internationaltin.org
CHANDLER, AZ — Isola Group is coming to Munich, Germany and Electronica 2022 with an assortment of circuit materials expected to meet or exceed the needs of the broad range of markets the international event serves. Set for November 15-18, 2022 in the Trade Fair Center, Messe Munchen, Electronica 2022 is the world’s leading conference and exhibition for the design and production of all things electronic, from consumer products to long-lasting assemblies built for space. Isola Group will be in Hall B1, Booth #422 at the show. Isola’s material experts will welcome visitors with advice and guidance on optimum use of the company’s most popular laminates and prepregs.
Like Electronica 2022, Isola’s circuit materials cover a broad spectrum of markets, for printed circuit boards (PCBs) in everything from portable electronic devices and automotive safety systems to Fifth Generation (5G) base stations and small cells and satellite communications (satcom) systems. The materials are “made for manufacturing,” formulated with characteristics that enable different circuit materials to be fabricated with compatible processes, even when they are used to form multilayer, multiple-signal PCBs with a blend of analog, digital, and power circuitry. Isola’s materials on display will include I-Tera® MT40, I-Tera® MT40 (RF/MW), Astra® MT77, Tachyon® 100G, TerraGreen®, TerraGreen® (RF/MW), and TerraGreen® 400G.
These high-performance circuit materials feature key parameters, such as high glass transition temperature (Tg) and decomposition temperature (Td) to encourage compatibility of processing. The materials offer circuit designers and PCB fabricators a wide choice of circuit performance parameters, including permittivity (Dk) and dissipation factor or loss (Df), with behavior that remains stable over wide operating temperature ranges, making them suitable choices for many growing electronic applications including Advanced Driver Assistance Systems (ADAS) and their 77 GHz mmWave radar circuits, 5G wireless communications networks, and smart energy systems.
I-Tera MT40, which is a good starting point for many high-speed digital (HSD) circuits and RF/microwave PCBs, is RoHS, lead-free process compatible and FR-4 process compatible. With a Dk that is stable with frequency (3.45 through 10 GHz) and over wide temperature ranges, it forms reliable PCBs for HSD and also microwave applications. For higher microwave frequencies, I-Tera MT-40 (RF/MW) offers Dk tailored to a user’s requirements but boasts performance consistent with time, temperature, and frequency, which is true for the general-purpose/HSD versions of the material as well.
When circuit loss is a concern, few circuit materials can match the performance of Isola’s Astra MT77 laminates (also available as prepregs without copper cladding) and their low Df of 0.0017. Also, FR-4 process compatible, these materials are ideal candidates for the mmWave portions of 5G networks and the 77 GHz radar circuits in ADAS systems. For mmWave frequency coverage where low z-axis (thickness) coefficient of thermal expansion (CTE) is required, Isola’s Tachyon 100G provide extremely high stability over frequency and temperature through 100 GHz analog frequencies and 100 Gb/s digital rates. And for designers and PCB producers in need of high-performance, halogen-free circuit materials, Isola’s TerraGreen, TerraGreen (RF/MW), and TerraGreen 400G provide lead-free RoHS-compliant solutions usable for PCBs operating through high microwave frequencies and high-speed digital rates. Visitors to Electronica 2022 are welcome to visit Booth #422 to learn more.
