WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension”, “NANO” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, today responded to the statement released by Stratasys Ltd. (Nasdaq: SSYS) on April 18th, 2023:
“It is disappointing that Stratasys has resorted to sowing misinformation and falsehoods in its rebuff of Nano Dimension’s acquisition offer that would provide immediate and certain cash payment at a compelling premium to share price to Stratasys shareholders.
COURT RULED: NANO CAN COMPLETE THE STRATASYS ACQUISITION:
These claims are nothing more than a desperate attempt to mask the Board’s clear entrenchment and efforts to mislead shareholders. The facts speak for themselves.
The Israeli court’s ruling vindicated Nano Dimension’s position that its Board of Directors has the full authority to continue to lead and govern the Company as they have been, including as it relates to Nano Dimension’s proposed acquisition of Stratasys.
Clearly the Stratasys' board members are trying to exploit the court decision in order to interfere with the Company's intention to initiate a Special Tender Offer to the shareholders of Stratasys in order to preserve their position as board members. In its ruling from April 16th, 2023, the district court in Lod, Israel, rejected Murchinson’s motion and stated explicitly that Murchinson’s motion “whereby the Company will not be allowed to take any action that is not in the ordinary course of business… will harm the Company in an excessive way” and explicitly mentioned the completion of the Stratasys transaction as an example where such a restriction cannot be accepted.
The Company has a clear and full authority to take actions that are not in the ordinary course of business including the Stratasys transaction and any claim made to the contrary by Stratasys is false and misleading.
MURCHINSON & ANSON’S ILIGAL ACTIONS:
The Company intends to appeal against the appointment of the two observers. The fact remains that Murchinson and Anson’s sham vote was illegitimate and invalid. Nano Dimension is appealing to the Israeli Supreme Court to block the Court’s temporary appointment of the two Murchinson observers, which is not for the best interest of the Company and its shareholders; those observers have one goal – to interfere with the Company’s business affairs and transactions and as a result harm the interests of the Company’s shareholders. Murchinson’s aggressive action to call an illegal shareholders meeting should not be rewarded with an appointment of two observers, where other shareholders do not enjoy the same right.
Murchinson and Anson’s Invalid Meeting Results Demonstrate Nano Dimension Shareholders’ Lack of Interest in their Agenda: Over 90% of Nano Dimension shares, excluding those owned by Murchinson or Anson, either voted against Murchinson’s nominees or took no action. In other words, excluding their own shares, Murchinson and Anson garnered support representing less than 9.5% of shares voted. The embarrassingly low voter turnout is proof that Nano Dimension shareholders will not be coerced by an actor who the Company believes is solely interested in making a quick profit at the expense of substantial potential long-term value for other shareholders.
“IT’S TIME TO ALLOW STRATASYS SHAREHOLDERS TO HAVE THEIR SAY:
Nano Dimension will continue to proceed towards acquiring Stratasys as it prepares for an all-cash special tender offer at $18.00 per share, which would allow shareholders to choose for themselves and receive a significant and immediate premium for their shares.”
LYON, FRANCE – Overall memory packaging revenue is estimated to have been US$15.1 billion in 2022, excluding testing. This corresponds to around 10% of overall stand-alone memory revenue, around US$144 billion in 2022. Yole Intelligence, part of Yole Group, forecasts that revenue will reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.
According to Thibault Grossi, Senior Technology and Market Analyst, Semiconductor & Software Division at Yole Intelligence: “In terms of packaging revenue, DRAM will grow with a CAGR22-28 around 13% while NAND will grow faster, with a CAGR22-28 of 17%. Other memory technologies, such as NOR Flash, EEPROM, SRAM, and emerging NVM, are forecasted to grow with a CAGR22-28 of around 3%.”
AP has become a key enabler of technological progress for NAND and DRAM. Among the different AP approaches, hybrid bonding has emerged as the most promising solution to manufacture higher bit density and higher-performance memory devices.
Whether its use is intended to enable higher performance or smaller form factors, advanced packaging is an increasingly important factor in the memory value equation. From representing about 47% of memory packaging revenue in 2022, AP will represent 77% by 2028.
In this context, Yole Intelligence releases its new product: Memory Packaging 2023 report. In this study, the company – part of Yole Group – presents an overview of the semiconductor memory market, provides an understanding of memory packaging technologies and markets, and offers market forecasts for memory packaging. This report also describes the memory packaging business and delineates and analyzes the competitive landscape.
Wire-bond is the dominant packaging approach. It is widely used for mobile memory and storage applications, followed by flip-chip packaging, which continues expanding in the DRAM market.
The adoption of flip-chip packaging with short interconnects is essential to enable high bandwidths per pin. While wire-bond packaging may still meet DDR 5 performance requirements, analysts expect flip-chip packaging to become a must-have for DDR6.
Leadframe remains widely used for NOR Flash and other memory technologies and is the package with the highest volume of unit shipments.
WLCSP is being increasingly adopted for consumer/wearable applications requiring small form factors, such as True Wireless Stereo earbuds. It is found in low-density memory devices such as NOR Flash, EEPROM, and SLC NAND.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, released a video in which Yoav Stern, Chairman and Chief Executive Officer of the Company, provides an in video analysis of the Stratasys transaction for shareholders and employees of Nano Dimension and Stratasys.
Mr. Stern outlines the Stratasys transaction and highlights the advantages that the transaction and a merged company could offer.
TUCSON, AZ – Dave Ryder, President of Prototron Circuits of Tucson Arizona, has announced the signing of Jack Lorber of Sourcing Specialist to represent his company in the Northeast.
“We are very glad to have Jack Lorber join the Prototron sales team. His knowledge and experience in sales and sourcing will go a long way towards helping us expand our business in that corner of the country,” said Mr. Ryder when making the announcement.
“Prototron Circuits’ approach to customer care and service is perfectly aligned with the way I do business. I am excited to be working with a company that’s so focused on putting their customers’ needs first. I look forward to working with Dave and Russ and the rest of the team at Prototron Circuits,” added Mr. Lorber.
HERTFORDSHIRE, UK – In a first of its kind for the sector, the International Tin Association (ITA) has launched its strategic report – TIN2030: A Vision for Tin. This thought-leading initiative has been compiled in collaboration with a broad range of stakeholders from across the sector. Identifying both opportunities and challenges, it highlights the crucial role of tin as a resource to enable the global energy transition and digitalisation. There will be new opportunities to work together on ESG issues to underpin supply.
“Looking into the next decade, the tin industry faces dramatic new market dynamics and ESG demands. It is important for us in the sector to understand what lies ahead so we can take advantage of the unprecedented opportunities and challenges”, said Helen Prins, CEO of ITA. “We foresee that the next decade will see a wakeup to tin with a new wave of efforts to secure a sustainably sourced supply.”
The report highlights the impact of global changes on the sector. Changes such as rising geopolitical tensions, climate change urgency and macroeconomic shocks. According to the ITA research, this will lead to increased competition for vital resources including tin. Tin supply chains will need to adapt rapidly to meet these challenges while also working together to manage increased ESG expectations and demonstrate how the tin sector is building a better future for everyone.
The report highlights the importance of tin to everyday life and its growing role as an essential enabler for the energy transition and digitalisation. As the glue that holds together almost all electronic and electrical infrastructure, its significance will increase. Another strong indication that the demand for tin will surge. ITA estimates that $1.4 billion is needed to deliver 50,000 tpa more tin by 2030.
Better communication and collaboration on ESG will be needed to develop a holistic understanding of risks and meaningful standards. Increased engagement with ASM will increase business opportunities and rewards. The market will differentiate companies who strive beyond minimum requirements, including those achieving UN 2030 SDG’s.
TIN2030 represents a landmark effort in terms of bringing the industry together to think about the future of the sector. A pioneering effort led by ITA in its unique position at the heart of the industry. Through this holistic approach, ITA has been able to integrate perspectives from across the sector to best understand what the future is likely to hold for this vital metal.
WASHINGTON DC – The recent partnership announced by the U.S. and Canada is a welcome acknowledgement of the urgent need to support the American printed circuit board industry. The Presidential determination of printed circuit boards as essential to national defense under section 303 of the Defense Production Act is welcome news, and achieves a 2023 goal of the Printed Circuit Board Association of America (PCBAA).
The $50 million identified is a downpayment on what must be a larger and sustained effort by the U.S. government to rebuild this critical manufacturing sector. The American printed circuit board industry was decimated by offshoring over the past 20 years, dropping from almost 30 percent of the world’s supply to only 4 percent today. The U.S. depends on other nations -- primarily in Asia, and more than half from China.
“We are eager to work with the Administration to make the best use of this and advocate for subsequent funding for this long-overlooked industry”, said Travis Kelly, Chairman of the Printed Circuit Board Association of America and President and CEO of the Isola Group. “The costs of creating new facilities or upgrading existing printed circuit board facilities can run into hundreds of millions. Just as legislation and policies were created to support semiconductors, the U.S. government needs to invest in our nation’s future by providing support for printed circuit boards.”
