WEST CHICAGO, IL – PCB fabricator American Standard Circuits has recently purchased and installed the CIMS Galaxy 30µ automated optical inspection machine as part of their ongoing facility update.

The CIMS Galaxy VIA series represents the family of models designed to support inspection of through laser via in high volume manufacturing of advanced HDI or IC Substrates with the Galaxy VIA 30µ being capable for inspection of via holes down to 30 µm in diameter.

“With our need for speed and accuracy, especially as our boards get denser, we decide that this was the very best test equipment for us at this time,” commented president and CEO Anaya Vardya. “The increased throughput capacity was one of the deciding factors when making our decision.”

The system’s illumination is powered by unique ViaLight™ technology providing a transmissive light source built within the scanning table. The optional Microlight™ illumination provides simultaneous light coverage from the top ensuring the most accurate and complete acquisition of external and internal shape of a through via hole.

The systems within Galaxy VIA series can inspect through laser via drills as small as 20 microns in diameter, detect undersize and oversize defects, contamination, and debris inside, plugged or missing holes as well as drill shifts beyond allowable tolerance.

Powerful statistical packages further extend capabilities of Galaxy VIA series providing real time process control used for laser drill tool calibration.

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