CAMBRIDGE, UK – With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.

Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).

The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material's relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.

Dk (Dielectric Constant) and Df (Loss Tangent):
A material's dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.

Elongation to Failure:
For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.

CTE (Coefficient of Thermal Expansion):
To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.

Young's Modulus:
For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young's modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.

Moisture Absorption:
Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.

In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.

IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.

To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP

FREUDENSTADT, GERMANY – Robert Bürkle has divided its company into four independent divisions to better serve customers.

The German supplier provides laminating and coating technologies to the glass industry.

The company will have four independent business divisions to cover its respective product segments.

The new divisions will be managed by Marco Schaible (Printed Circuit Boards), Kai P. Treuner (Photovoltaics, Glass and Plastic Cards), Matthias Picker (Surface/Woodworking) and on an interim basis by Dr Arno Rogalla (Automation, Insulation, Doors, Parquet).

Jürgen Schröer, CEO of the Bürkle Group, said: "We are convinced that this model is more efficient and that the individual divisions will be able to react much faster and more targeted to individual customer requirements in the future.”

Mr Schröer has been supported by Martin Meister since the beginning of 2023, who, in addition to managing the commercial divisions, will also focus on the global development and digitalisation of the company.

Kai P. Treuner is responsible for the photovoltaics and technical glass division as well as for the plastic card division. Through his previous activities in other companies, Treuner brings many years of experience, especially in the field of glass and photovoltaic applications.

In the coming years, each division is to develop independently with different focal points in terms of the range of services, the product range and the global positioning to optimally serve the markets and the customers.

CAMBRIDGE, UK – Flexible hybrid electronics (FHE) promises to combine the benefits manufacturing of printed electronics capabilities of mounted components. Best expressed as 'print what you can, place what you can't', this rapidly emerging approach to electrical circuit manufacturing enables rapid prototyping and roll-to-roll manufacturing along with flexibility and even stretchability.

While FHE has many applications, we perceive wearable healthcare as the most promising in the short term, with longer term potential for industrial monitoring, automotive interiors, smart packaging, and integration into consumer goods. This broad addressable market has led to the recent emergence of contract manufactures offering or indeed specializing in FHE production, including via R2R manufacturing.

Dr Matthew Dyson, a Principal Technology Analyst at IDTechEx who covers printed/flexible electronics, will discuss the following topics:

• An introduction to FHE, including motivating factors
• Discussion of recent innovations and commercial developments within FHE
• Identification of technological gaps and potential solutions
• A roadmap for how the industry will develop, spanning both technologies and applications

This webinar is based on the new IDTechEx report, "Flexible Hybrid Electronics 2024-2034". This outlines innovations, opportunities, players, and trends across the technologies that underpin FHE, including flexible integrated circuits and low temperature component attachment. It also evaluates the opportunities for FHE across multiple application sectors, specifically automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial. The report includes granular market forecasts, delineating the adoption of FHE across over 30 specific use cases.

Webinar Title: Flexible Hybrid Electronics: The Best of Both Worlds?
Date: Thursday 17 August 2023
Duration: Approx. 30 Minutes

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1:00pm (UTC+12) Auckland, New Zealand
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10:00am (UTC) London
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12:00noon (UTC+3) Athens, Jerusalem
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9:00am (Pacific Time PT) USA & Canada
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11:00am (Central CST) USA & Canada
12:00noon (Eastern EST) USA & Canada
5:00pm (UTC+1) London
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WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that its board of directors has authorized a share repurchase plan (the “Repurchase Plan”), allowing the Company to invest up to $227.5 million to repurchase its American Depository Shares (the “ADS”).

The Repurchase Plan authorizes the Company’s management to repurchase ADSs, from time to time, in open market transactions, and/or in privately negotiated transactions or in any other legally permissible ways, depending on market conditions, share price, trading volume and other factors. Such repurchases will be made in accordance with applicable U.S. securities laws and regulations, under the U.S. Securities Exchange Act of 1934, as amended (the “Exchange Act”), and applicable Israeli law, and are subject to the approval of the Israeli court, which is meant to ensure that the Company has enough resources for the Repurchase Plan without affecting its other on-going obligations and commitments.

The Company may repurchase all or a portion of the authorized repurchase amount. The Repurchase Plan does not obligate the Company to repurchase any specific number of the ADSs and may be suspended or terminated at any time at management’s discretion.