LAKEWOOD, N.J. – August 3, 2023 – BidChip today announced its new platform that makes it possible for semiconductor customers to efficiently buy electronic parts they need from brokers without risk. The platform authenticates all components and vendor partners, guaranteeing safe purchases.
There are many places to buy electronic components, but one of the most reliable and convenient options is through an online electronic component sourcing marketplace like BidChip. Its comprehensive online marketplace provides a wide range of parts from trusted suppliers, ensuring high quality and fair prices. The process reduces price gouging by directly connecting buyers and suppliers.
BidChip leverages a large number of suppliers to secure a fair market value for semiconductor demand. It has discovered a way to enhance and streamline procurement safer, faster and economically. The platform uses a bidding process where buyers and suppliers compete daily to increase prices through an auction and reduce prices through a reverse auction, leveraging technology to streamline purchases. It empowers buyers and sellers to trade online without the fear of counterfeit merchandise, overdue payments or fraudulent transactions.
“I developed a successful system that addresses semiconductor commerce issues,” said CEO and founder Moshe Hezrony. “We streamlined the process while providing a set of protection services for the buyer and the seller, enhancing trust. Buyers and sellers will be equally protected. Risky transactions can go wrong and our goal is to keep the platform and process transparent for peace of mind.”
The auctions allow vendors to seek fair market value by leveraging a large group of buyers to submit bids for the best price. The bidding process allows fair buyer competition. Every day, buyers are given instant access to daily component offers.
The reverse auctions allow buyers who are seeking parts to purchase them at a fair market value and leverage a large group of suppliers that bid on the demand. The bidding process allows fair suppliers competition. Every day, suppliers are given instant access to daily component demands.
BidChip gives buyers an online shopping experience advantage for small and medium-size businesses. Now they can shop for semiconductors efficiently and risk-free with the assurance that all parts are authenticated and funds are guaranteed.
Electronic component sourcing websites are online platforms where buyers can locate and procure a wide variety of electronic parts and components. These platforms offer a convenient method of sourcing electronic components from multiple suppliers worldwide. BidChip is revolutionizing the industry by integrating the trading system of online auctions and reverse auctions, plus offering escrow services and lab testing that make it a unique system where manufactures can concentrate on assembling the next innovation while BidChip finds the parts for the next project. Sourcing electronic components has never been easier, faster, more efficient and more economical.
Other BidChip advantages include:
● Verified sellers and buyers to add security.
● Auction with transparent pricing and bidding for equal opportunity.
● Reverse auction (Quest) with transparent pricing and bidding for equal opportunity.
● Integrated escrow services for safe transactions.
● High standard of lab test AS 6081 to ensure part authenticity.
● A comprehensive dashboard to streamline the procurement process
Hezrony added, “Imagine your satisfaction, establishing instant trust with any buyer or supplier. You can trade lab-certified parts, get paid through escrow and ensure your business is always up and running.”
BidChip offers lab tests and escrow services for dedicated buyers and suppliers for safe trading and reducing price gouging. BidChip understands the challenges of not being able to trade freely. The company not only cares about parts but also the safety of your business.
For more information, to register now or schedule a discovery call, visit bidchip.com.
SANTA ANA, Calif., Aug. 02, 2023 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI or The Company), a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, and printed circuit boards (“PCB”), today announced that Todd B. Schull, the Company’s Chief Financial Officer, intends to retire at the end of 2023. Mr. Schull has also notified the Company of his intention to step down as the Company’s Executive Vice President & Chief Financial Officer, effective September 11, 2023. From September 11, 2023 to December 31, 2023, Mr. Schull intends to serve as a special advisor to the Company’s Chief Executive Officer, Thomas T. Edman.
In addition, the Company announced today that Daniel L. Boehle, age 51, has been appointed to succeed Mr. Schull as Executive Vice President and Chief Financial Officer of the Company, with a projected effective date of September 11, 2023. Mr. Boehle is expected to join the Company on August 21, 2023. From August 21, 2023 to September 11, 2023, Mr. Boehle is expected to serve as Executive Vice President of Finance for the Company.
Mr. Boehle has served as Vice President and Chief Financial Officer for Aerojet Rocketdyne Holdings, Inc. (“Aerojet”), a world-recognized technology-based engineering and manufacturing company that develops and produces specialized power and propulsion systems, as well as armament systems, since August 2020. From August 2017 to July 2020, Mr. Boehle was Vice President, Controller, and Chief Accounting Officer for Aerojet. Before joining Aerojet, Mr. Boehle served in various leadership roles across Corporate Accounting, Financial Reporting, and Financial Planning and Analysis at Northrop Grumman Corporation. Before joining Northrop Grumman Corporation, he held positions at KPMG LLP and KPMG Australia Ltd. Mr. Boehle has a B.S. in Accounting from Loyola Marymount University and a Master of Business Administration with an Emphasis in Finance and Entrepreneurship from the UCLA Anderson School of Management.
“Today we reflect on the past and embrace the future. I would like to thank Todd Schull for his 10 plus years of service to TTM and congratulate him on his sterling career. I speak for all of the TTM family as we wish him immense joy and fulfillment in his retirement. I am grateful for his leadership and friendship and will always cherish the invaluable contributions he made to TTM and his partnership with me. While we honor Todd for his career as he approaches retirement, we welcome Dan with excitement and open arms. I am confident that with Dan’s experience and expertise, he will help us to continue to forge a path of excellence as we execute on our core vision of inspiring innovation as a global preeminent technology solutions company,” said Tom Edman, TTM’s Chief Executive Officer.
About TTM
TTM Technologies, Inc. is a leading global manufacturer of technology solutions including mission systems, RF components/RF microwave/microelectronic assemblies, quick-turn and technologically advanced PCBs. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com .
BOSTON – Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs. Furthermore, this manufacturing methodology is moving out of research labs and into commercial production, with new and existing contract manufacturers now offering FHE.
IDTechEx's report "Flexible Hybrid Electronics 2024-2034" evaluates the status and prospects of FHE circuits, which we forecast to reach a market size of around US$1.8 billion by 2034 - more if the associated infrastructure, software, and services are included. Drawing on years of following the printed electronics industry and 40 interview-based company profiles, the report outlines trends and innovations in the materials, components, and manufacturing methods required. It explores the application sectors where FHE is most likely to be adopted, drawing on both current activity and an evaluation of FHE's value proposition. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities, such as skin temperature sensors and printed RFID tags.
Enabling Technologies
Manufacturing FHE circuits requires many current and developing emerging technologies that are essential to circuits. These include:
Low-cost thermally stabilized PET substrates that are dimensionally stable.
Component attachment materials compatible with flexible thermally fragile substrates, such as low-temperature solder and field-aligned anisotropic conductive adhesives.
Flexible integrated circuits based on both thinned Si and metal oxides.
Conductive inks based on both silver and copper.
Thin film batteries, especially if printable.
Printed sensors of all types.
Manufacturing methods for mounting components on flexible substrates.
The IDTechEx report assesses the status and prospects of each technology in detail, with recent developments and technological gaps highlighted and the merits of different approaches compared. This analysis is based on interviews with many suppliers and annual attendance at multiple printed/flexible electronics conferences. Furthermore, we profile 6 government research centers and a range of collaborative projects from around the world that support the adoption of flexible hybrid electronics, demonstrating the major players and technological themes.
Assessing Application Opportunities
With so many potential addressable markets, establishing where FHE offers the most compelling value proposition relative to alternative electronics manufacturing approaches is essential. As a manufacturing methodology rather than a specific product, the benefits of using FHE are highly dependent on the application.
For prototyping and high mix low volume production, printing with digital methods such as inkjet rather than chemically etching the conductive traces enables straightforward adjustments to design parameters. This brings multiple benefits, including shortening the product development process by reducing the time between design iterations and facilitating product 'versioning' to meet specific customer requirements without substantially increasing production costs.
Alternatively, for very high-volume applications such as RFID tags, smart packaging, and even large-area lighting, the compatibility of FHE with high throughput roll-to-roll (R2R) manufacturing via rotary printing methods such as flexography and gravure offer the potential for reduced costs. Rapid production can be expedited by low-temperature and/or high-speed component attachment methods, with competing approaches analyzed in detail within the report.
Flexibility and stretchability, of course, also form part of FHE's value proposition. While conventionally manufactured flexible PCBs already meet some application requirements, such as for making electrical connections in confined spaces, the resilience of many printed conductive inks to repeated bending and tighter curvatures offers a clear differentiator. FHE is thus well suited for wearable applications such as electronic skin patches and applications where conformality is enabled by stretchability, such as integrated lighting.
Comprehensive Insight
IDTechEx has been researching developments in the printed and flexible electronics market for well over a decade. Since then, we have stayed close to technical and commercial developments, interviewing key players worldwide, annually attending conferences such as FLEX and LOPEC, delivering multiple consulting projects, and running classes/ workshops on the topic. "Flexible Hybrid Electronics 2024-2034" utilizes this experience and expertise to summarize IDTechEx's knowledge and insight across the compelling and rapidly emerging manufacturing methodology of FHE.
To find out more about this new IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/FlexElec
TROY, MI – Altair (Nasdaq: ALTR), a global leader in computational science and artificial intelligence (AI) has named the winners of the 2023 Altair Enlighten Award. Presented in association with the Center for Automotive Research (CAR), the Altair Enlighten Award honors the greatest sustainability and lightweighting advancements that successfully reduce carbon footprint, mitigate water and energy consumption, and leverage material reuse and recycling efforts.
"The Altair Enlighten Award is a special award that showcases how the automotive industry's leading minds – from the biggest names to its newest startups – are applying advanced technologies and responsible AI to create a better, greener industry," said James R. Scapa, founder, and chief executive officer, Altair. "Lightweighting, optimization, and sustainability are more important than ever in the modern automotive industry. Altair is proud to honor the innovations that will drive the future of a sustainable industry."
"As always, we're honored to be presenting the Enlighten Award together with Altair, and we look forward to seeing what innovations this year's submissions bring as we work towards a more sustainable automotive ecosystem," said Alan Amici, president, and chief executive officer, Center for Automotive Research.
The complete list of all winning organizations, runners-up, and honorable mentions are below.
Honorable Mention: WorldAutoSteel, Ricardo plc – Steel Body Structures for Fully Autonomous Vehicles
Honorable Mention: Michigan Technological University for Auto/Steel Partnership – Steel E-Motive Side Closure Mechanism
The Enlighten Award winners will be announced in an awards ceremony at the CAR Management Briefing Seminars on August 1, 2023, at 7:30 a.m. ET. For more information about the Enlighten Award, visit https://altair.com/enlighten-award
Partners for the 2023 Enlighten Award include Automotive Engineering SAE, Tech Briefs, Auto Bild Japan, Automobile Industrie, and the Korean Society of Automotive Engineers (KSAE).
TechSearch International’s latest analysis examines demand for packages used in AI. As the industry enters the AI era, successful hardware deployment requires a supply of silicon interposers, or alternatives such as redistribution layer (RDL) structures and advanced laminates, to support high density. With the desire to add more and more high bandwidth memory (HBM) stacks, the size of the interposers is growing, driving demand for larger build-up package substrates. TechSearch International analyzes industry readiness with silicon interposers (and alternatives), large body-size packages, and HBM.
Reliability issues for large body size packages are highlighted. Demand projections are provided for interposers and HBM. Supply and demand for build-up substrates is examined, given the need for large substrates. The report also examines the status of glass for substrates and provides an update on the technology. The report points out challenges to be addressed.
While wafer-to-wafer (W2W) hybrid bonding has been in production for image sensors for many years, and is seeing growing use in the production of NAND Flash, die-to-wafer (D2W) adoption is in the early stages. The report analyzes the adoption for memory on logic, logic on logic, and the future for HBM. Research activities and challenges are discussed.
RF package trends are highlighted with an in-depth examination in the mobile space. Alternatives to laminate substrates are discussed. The report examines OSAT financials, discussing prospects for the year.
The latest Advanced Packaging Update is a 110-page report with full references and an accompanying set of ~100 PowerPoint slides.
CARSON CITY, NV – Taiyo America has announced a new partnership with LiloTree. This partnership is part of the ongoing strategy to provide innovative technology to the PCB industry. LiloTree has developed an innovative nickel-free and Cyanide-free gold plating process that offers many advantages to the standard ENIG process.
The benefits of LiloTree’s technology are:
No corrosion on pads / no black pads
Long term reliability of gold-plated surface
Able to plate tight HDI features
Sustainability with cyanide-free
“With our strong solder mask presence in the marketplace, we will introduce the LiloTree technology to all the PCB manufactures in North America and Europe. LiloTree’s technology fits in line with Taiyo’s continued support to the industry in providing the most innovative products for the manufacturing of PCBs.” says Zach Maekawa, President at Taiyo America.
“LiloTree is extremely happy about this new partnership says Kunal Shah, President of LiloTree. “Taiyo’s has a long-standing relationship with all the PCB manufacturers in North America and Europe and we are confident that they will help us in introducing our technology to the PCB industry. We both share a common goal to bring new technology to the market.”
Taiyo America was established in 1990, in Carson City, NV as a manufacturing subsidiary of Taiyo Holdings Co., Ltd. (located in Japan). We have been exceeding the industry’s needs for solder mask products, legend inks, thermal management inks, and direct imaging products to consistently meet the ever-growing and changing demands for printed circuit boards. LiloTree is a global supplier of surface finishes to PCB and IC manufacturing.
It is an advanced materials technology company, providing next-generation technology solutions through chemistry and materials innovations. Based in Redmond, Washington, we manufacture Ni-less ENIG-Premium, ENIGPremium and other surface finishes, eco-friendly patented plating solutions offering optimum performance and better reliability at lower cost for electronic assemblies.
