PETACH TIKVA, ISRAEL – Eltek Ltd. (ELTK), a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced Tuesday that the company has received a purchase order in the amount of $2.9 million from an existing customer.

The order will be supplied by Eltek over a period of 16 months commencing in February 2024.

CAMBRIDGE, UK – It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. As such, increasing efforts are being made to mount integrated circuits (ICs) and other components such as antennas closer together, sometimes within the same semiconductor package. This proximity means that conventional board-level shielding of electromagnetic interference (EMI) with metal enclosures is being replaced with package-level shielding, with metallic coatings applied directly to semiconductor packages.

IDTechEx’s report “EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications” explores the current status and technology trends within this essential aspect of many electronic circuits. Based on IDTechEx’s expertise in evaluating developments within advanced semiconductor packaging and conductive inks, the report provides a comprehensive overview of the status, innovations, players, and opportunities within EMI shielding, focusing on developments at the package level.

Conformal package-level shielding is especially important for consumer devices where both ness and wireless communications are needed. These include smartphones, smartwatches, and AR/VR headsets. By analyzing a range of teardowns, the report identifies the types of IC packages with conformal shielding and forecasts the market for conformal EMI shielding across multiple applications.

Emerging deposition methods

At present, sputtering is the dominant method of creating conformal EMI shields. Deposition occurs in a vacuum chamber, with ions fired at a metallic ‘sputtering target’ to produce nanoscale metal particles that coat the package surface. While the capital equipment is expensive, the metallic sputtering targets are cost-effective, with many providers having existing systems installed.

Emerging methods such as spraying and printing are gaining traction and offer much lower equipment costs since no vacuum chamber is required, along with additional benefits such as reduced variation in package top and side coating thickness and fewer process steps. However, conductive inks are typically more expensive than equivalent sputtering targets per gram of deposited material due to the additional ink formulation steps. The report evaluates the merits of different deposition techniques and discusses the key players.

An additional benefit of techniques such as inkjet printing is digital selective deposition, which enables reduced material consumption and hence mitigates the higher material costs of conductive inks. As the trend towards ‘system-in-package’ architectures gains further traction, greater use of compartmentalization will increase demand for selective deposition, such as the top of a specific compartment. In the longer-term, approaches such as fully additive 3D electronics will enable EMI shielding to be integrated throughout a complex bespoke package containing multiple compartmentalized components.

<pMaterial developments

While materials for board-level shielding enclosures, and indeed sputtering, are straightforward metals and metal alloys (typically copper, steel, aluminum, zinc, or nickel), there is considerable innovation within solution processable conductors for package-level shielding. Silver-based conductive inks dominate, with available products spanning a wide range of particle sizes and rheology. The report outlines the properties of competing conductive inks marketed at EMI shielding and the status of material innovations.

Especially notable is the increasing adoption of particle-free (also known as molecular) inks, which are metalized in situ and hence produce smooth coatings and eliminate the risk of nozzle clogging. Metamaterials, in which periodic structures are introduced during manufacturing, can also be used to introduce frequency-dependent EMI shielding if desired. Another material alternative for solutions processable EMI shielding is MXenes. This term refers to a class of materials made up of metal carbides or metal nitrides that have excellent conductivity and are lightweight.

Comprehensive coverage

IDTechEx’s report “EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications” provides a detailed overview of the EMI shielding for electronics market, with a focus on innovations that will support the increasing adoption of heterogeneous integration and advanced semiconductor packaging. 10-year forecasts for both deposition method and conductive ink consumption are provided, drawing on analysis of consumer electronic device to assesses the semiconductor package area requiring conformal shielding. Forecasts are segmented across multiple application categories, including smartphones, laptops, tablets, smartwatches, AR/VR devices, vehicles, and telecoms infrastructure.

For more information on this report, please visit www.IDTechEx.com/EMI, or for the full portfolio of research available from IDTechEx please visit www.IDTechEx.com

OSAKA, JAPAN – Flexible printed circuit boards (FPCs) have found uses in a wide variety of applications, including health/wellness, mobile devices, aerospace and many more. Conventional FPCs consist of copper patterns formed on the surface of a flexible film using standard subtractive printed circuit board fabrication processes. Historically, polyimide resin (PI) has been widely used because it is readily available and possesses heat-resistant properties which make it compatible with high-volume assembly processes like solder reflow. However, new applications and device designs like wearables are driving the development of more conformable circuits. Stiff, high-modulus films such as polyimide are not suitable for these products. Currently available pliable, low modulus films like thermoplastic polyurethane (TPU) are not compatible with conventional surface mount (SMT) assembly processes. Researchers at Panasonic Electronic Materials are developing a new material technology that overcomes the limitations of these conventional FPCs.

Development of Copper Clad Stretch (CCS)

To address the limitations imposed by (1) the stiffness of polyimide and (2) the poor heat durability of TPU, the researchers developed an innovative approach using a copper-clad pliable and stretchable thermosetting resin. This construction is abbreviated CCS for Copper Clad Stretch technology; meaning it can be stretched, unlike conventional copper clad laminates (CCLs). The same resin system is used for both the circuitry layer and the insulative coverlay. The coverlay construction consists of a PET protective film, uncured resin, and polyimide release liner. The unique thermosetting polymer technology can be used in both fully-cured and un-cured format depending on the application. The polyimide release liner in the coverlay also acts as a mechanical support for the soft circuit board during SMT process discussed later in the paper.

Heat Durability

Assuming exposure to typical SAC (Tin-Silver-Copper alloy) reflow conditions in the SMT process, the researchers conducted a solder float test at 288°C for 10 seconds and confirmed that no blistering or delamination of the CCS occurred. And the bare film made by etching CCS showed pliability and stretchability even after the solder float. On the other hand, TPU which is a thermoplastic resin, melted almost instantaneously and turned out to be incompatible with this SMT process.

Mechanical Properties

The resin of CCS is much more pliable than polyimide, leading to accommodation of various device form factors such as twisting and bending. Therefore, it is well-suited for non-planar and dynamic applications in healthcare, wearables, and the like.

A 10%-stretch cycle test for 10,000 cycles was conducted using a serpentine-patterned CCS. The sample finished the test without any failures in copper pattern. That means CCS has durability for stretch and is suitable for application requiring movements.

CCS Compatibility with Standard FPC Fabrication Processes

CCS was evaluated for standard PCB double-sided processes compatibility which consist of mechanical drilling, wet desmear, plating, chemical etching, coverlay patterning-molding, and surface mounting technology (SMT). The CCS could pass through the process. The polyimide release liner in the coverlay acted as a support structure for avoiding deformation during SMT.

Conclusion

This new CCS technology exhibits pliability and stretchability not possible with polyimide FPC products. Because of the temperature-resistant thermosetting resin system, CCS is compatible with reflow in the SMT process that TPU cannot withstand. As a result, CCS can be a foundational technology for building more pliable, conformable, and even stretchable devices utilizing conventional FPC manufacturing processes.

As a use case of CCS, a reconfigurable intelligent surface (RIS) has been developed by researchers in Osaka University to effectively deliver the radio waves in 6G band. The radio waves at these frequencies are easily blocked by buildings and other physical structures. Researchers in Osaka University fabricated a metasurface reflector that can be attached to various locations and whose angle can be adjusted by expanding and contracting. By the combining a metasurface pattern and the inherent stretchability of CCS, it is possible to reflect radio waves efficiently.

In addition to the research noted above, there are many product development projects in progress using the CCS technology. Panasonic Industry is proceeding with the development of CCS technology together with our customers and preparing for mass production.

SHANGHAI, CHINA – As a leading global supplier of electronic components, WIN SOURCE has solidified its position among the elite with a new ranking on SourceToday's 2023 Top 50 Electronics Distributors list. WIN SOURCE landed at number 18 this year, up from number 30 in 2022, showcasing its rapid growth and influence in worldwide electronics distribution.

The company attributes its high-ranking success to an unwavering commitment to customers, sustainable practices and harnessing technology. By integrating its core values into strategies across the business, WIN SOURCE has built trust and expanded its reach.

"We are thrilled to be recognized among the very top electronics distributors globally," said WIN SOURCE CEO Ethan Tsai. "This achievement reflects our dedication to optimizing every aspect of the supply chain experience, from procurement to delivery and beyond."

WIN SOURCE's customer-centric approach is key to its operations. The distributor can deliver quality components at competitive prices with transparency, tailored service and rapid fulfillment driving the business. A massive inventory of over 1 million SKUs ensures customers can access needed parts with ease.

"Our mission is to streamline procurement for electronics manufacturers around the world," Tsai said. "By making our customers' jobs easier, they can focus more resources on the innovative products and solutions relying on our components."

In addition to customer service, WIN SOURCE believes adopting sustainable practices is critical for future success. The company actively works to transform its facilities and operations to reduce environmental impact. From green buildings and energy-efficient data systems to paperless digital processes, WIN SOURCE paves the way for an eco-friendly supply chain. Employees also undergo regular training on sustainability principles and culture.

Embracing emerging technologies further propels WIN SOURCE's forward momentum. The distributor harnesses data analytics and automation to enhance efficiency, insights and scalability across its growing business.

"Digital transformation allows us to take customer experience to the next level while preparing our operations for the future," Tsai remarked.

WIN SOURCE's measured digital approach combines automated order processing and tracking with hands-on account management. This strategy provides the benefits of an advanced platform and a human touch. As the company expands, new technologies will enable scaling up without compromising service quality or the environment.

With its balanced strategy, WIN SOURCE achieved over $600 million in revenue last year – a 57% increase from 2021. Its global footprint now spans six countries across North America, Europe and Asia. By joining forces with over 3,000 manufacturers, WIN SOURCE's supply network reaches all corners of the electronics industry.

Tsai believes WIN SOURCE's greatest asset is its people. "Our employees drive our values every day and are the reason we continue to innovate and grow," he said. "Their expertise and dedication make a true difference for our customers and partners around the world."

As a purpose-driven organization, WIN SOURCE measures success not just in revenue and rankings – but in positive impacts made. Tsai concluded, "We'll always strive to be responsible global partners, empower our customers and build a more sustainable future."

For more information, visit win-source.net