CHANDLER, AZ – Rogers Corporation (NYSE:ROG) will exhibit at the IEEE International Symposium on Antennas & Propagation (IEEE AP-S) in Portland, Oregon (Booth #108) on July 25th-26th.
The IEEE AP-S conference is intended to provide an international forum for the exchange of information on state-of-the-art research in antennas, propagation, electromagnetic engineering and radio science.
Rogers’ Technical team will be presenting two papers on novel material solutions. Conference attendees can learn about “Dual Band Dual Polarized Electrically Small Antenna Employing a Magnetic Material” (July 27 th at 8:40 a.m.) and “High Performance Dual-Band Antenna Using Rogers Magneto-Dielectric Material for GNSS Band” (July 28 th at 2:00 p.m.) at these technical sessions.
Key Rogers’ products being featured:
Radix™ 3D Printable Dielectrics family of products, with the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix 3D Printable Dielectrics are proprietary composite materials designed for the scalable manufacture of gradient index and controlled Dk 3D structures, through a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX ® 555 High Impedance Laminates : The first commercially available low loss laminate with controlled and matched permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers’ proprietary TMM® ceramic, thermoset polymer composites are designed for high frequency applications. Commonly available in laminate form, Rogers also offers capabilities to produce molded, 3- dimensional shapes of TMM material. Shaped TMM components open up a new range of innovative design solutions for high or low frequency applications requiring controlled dielectric constant with low loss factor.
TMM molded components can help designers eliminate costly machining and assembly steps, create smaller components, and improve SWaP at the system level. Select Metallization of TMM Shapes is possible, but highly application dependent.
Consultation with one of Rogers’ technical experts can guide the success of designs. They will be available to discuss the most demanding applications from Phase Array Radar Antennas, high frequency magneto-dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it closed a series of landmark sales of Additive Manufacturing printers and Additive Electronics robotics systems in Q2/2023 which are material in size and customers’ profiles that are leading and large-scale businesses and organizations.
These sales are only a portion of the Company’s $14.8 million in sales for the quarter (preliminarily results were announced last week), but they are material due to both the financial terms and perhaps more importantly to the profile of the customers which we look forward to continuing to support in the future. The initial sales totaling over $4 million in revenue and include some recurring revenues are to businesses and organizations that are leaders in their respective fields. While the names of the customers cannot be shared as they are defense related and/or focus on IP sensitive work, a partial list of the organizations includes: a space exploration company, a satellite equipment innovator, a national defense agency, a nuclear research group, and a computer manufacturer.
The portfolio of products sold are from across Nano Dimension’s product lines with a notable portion being the DragonFly® IV System for Additively Manufactured Electronics (“AME”) and a range of Additive Electronics robotics systems. These products are leveraged for a range of uses from innovation and prototyping to high-mix, low-volume production.
Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, added, “We are proud of our progress with sales not only increasing by revenue and gross margin metrics – quarter-over-quarter, year-over-year – but we are also seeing that the profile of customers who choose to do business with us is advancing up to the higher levels. These customers are leaders in performing some of the most demanding, forward-looking work that will keep us safe and define our future, or both. These are only a portion of our revenue, but a great indicator of our success – and an encouraging indication for the future.”
KEMPEN, GERMANY – Value orientation, experience, responsi- bility, innovation: These four terms are written on the coloured stickers that Brigitte and Ralf Schwartz as well as Britta and Benjamin Alfes are pinning on the blue Peters barrel. After this, the employees stick their labels on the barrel, showing words like team spirit, courage, motivation, communication, appreciation and flexibility - being the raw materials for successfully shaping the future of the family business together.
Within a staff meeting, the Management of the family-owned company founded 53 years ago informed the staff of the coatings manufacturer based in Lower Rhine Area, and took them along into the future. The third generation, Britta and Benjamin Alfes, have been appointed to the Management team with immediate effect, thus completing the team together with Brigitte and Ralf Schwartz. On 31 December 2025, the second generation Brigitte and Ralf Schwartz, will retire from the active business of the Peters Group. From 1 January 2026 onwards, the granddaughter of the company founder Werner Peters who passed away in 2017 at the age of 85, and her husband Benjamin Alfes will be sole managing directors.
The two 33-year-olds have been involved in the company for a good six years and spent a year in Shanghai in 2019, where they helped to shape the newly founded local subsidiary. Britta Alfes studied International Business in Maastricht and, together with her husband Benjamin Alfes, has been part of the Peters team at the Peters headquarterssince 2017. Benjamin Alfes studied Industrial Engineering at the Technical University of Aachen and, like his wife, graduated from the Luise-von-Duesberg-Gymnasium in Kempen in 2009.
Ralf and Brigitte Schwartz have been at the helm of the company for around 40 years and, with a motivated workforce, have made Peters into one of the world's leading full-range suppliers of coating materials for electronics.
The employees at the Peters headquarters in Kempen were receiving the family's decision with applause. "We have given a lot of thought to the strategic development of our company and the responsible transfer of responsibilities," emphasised Ralf Schwartz, spokesman for the Management.
Brigitte Schwartz points out that the transition process will be carried out involving the staff. "Securing your jobs and our business relationships are our top priority," says Werner Peters' daughter.
"For a transformation into the future world, we need innovation in organisational structures, processes, services and products," Benjamin Alfes explains. Britta Alfes adds: "By acting sustainably in every workplace, we want to take responsibility for this generation and the next.
Both are prepared to contribute to the successful continuation of Peters and its growth. The parents are visibly proud of this.
PLANO, TX – Siemens Digital Industries Software announced today that it will expand its Strategic Collaboration Agreement (SCA) with Amazon Web Services (AWS) to focus on helping mutual integrated circuit (IC) and electronics design customers leverage AWS’s advanced cloud services to shorten design cycles, optimize engineering resources and boost verification coverage using current and forthcoming Siemens EDA products. This extended SCA builds upon the companies’ strong track record of providing customers with the agility, flexibility and adaptability needed to help turn ideas into innovation with greater efficiency and speed.
High performance cloud computing provides IC and systems developers with effective ways to address the ever-expanding design complexity, demand for massive computing capacity, and the challenge of distributed, cross-organization collaboration. When leveraging the right partners, architectures, and security practices, the cloud can help accelerate design and verification cycles, while enabling productivity improvement and assist customers in focusing resources on the highest-value activities.
“For many years, Arm has successfully run a broad array of EDA solutions from Siemens on Arm Neoverse-based AWS Graviton instances to rapidly simulate and verify our IP. Using Siemens’ Questa software, we’ve simulated processor designs with the latest Graviton3, reducing our time to result by 20-30 percent,” said Mark Galbraith, Vice President of Productivity Engineering, Arm. “Leveraging world-class technologies from industry leaders like AWS and Siemens EDA ensures Arm IP will continue to enable the world’s leading IC design and systems companies to differentiate and win in competitive markets.”
Siemens and AWS are collaborating to develop Cloud Flight Plans, which are best-known methods (BKMs) and technologies for running Siemens’ EDA tools in customers’ AWS environments. Cloud Flight Plans are ideal for customers looking to self-manage their AWS environments.
“IC development is a compute-intensive process, so having ready access to additional capacity and alternative system configurations is extremely valuable to our customers,” said Craig Johnson, Vice President, EDA Cloud Solutions for Siemens Digital Industries Software. “Deployment complexity has historically been a major challenge. Our expanded collaboration with AWS focuses on combining our mastery of electronics design with AWS’s infrastructure, consulting and cloud deployment assistance to accelerate our mutual customers’ outcomes.”
“AWS is accelerating the performance of IC and electronics design workloads by delivering elastic, high-performance computing (HPC) for the most sophisticated EDA solutions,” said, Bill Vass, Vice President of Engineering, AWS. “Our strategic collaboration with Siemens allows mutual customers to create innovate new products in the cloud today, and now includes significant semiconductor innovation with Siemens EDA.”
BERLIN – MKS’ Atotech announced today that its Printoganth® “RC” product series has been certified to meet all requirements for ISO 14021:2016 by SGS, an internationally renowned testing, inspection, and certification company. This certification marks an important milestone in the company’s efforts to support customers and OEMs along their sustainability journey.
Harald Ahnert, Vice President and General Manager of MKS Materials Solutions Division’s Electronics business said: “We understand the importance of sustainable production for the industries we serve as the need for manufacturers to live up to the 4Rs (Reduce, Reuse, Recycle, and Replace) has become more important than ever across global supply chains as countries and industries alike continue to advance their sustainability goals.
“We are pleased to play our part and are proud that MKS’ Atotech brand today is recognized around the world as a complete solutions provider, offering customers and OEMs a wide variety of advanced and environmentally-sound production equipment and process chemicals for the manufacture of mission-critical electronic components. By utilizing systems designed around the efficient use of water, energy, and raw materials, we can contribute to reduced waste while generating greater savings for our customers.”
Harald Ahnert noted that the Atotech brand has a storied and successful history of introducing standard-setting solutions to build its comprehensive portfolio that has earned it a reputation for high-quality and reliable solutions that help customers reduce their environmental impact.
One example is MKS’ Atotech innovative processes using recycled copper. By offering electroless copper products based on 100% recycled copper, MKS reinforces its position as a pioneer in providing sustainable surface modification, metallization, plating, and finishing solutions for the manufacturing of printed circuit boards and package substrates with verified chemicals for advanced processing.
Harald Ahnert concluded: “Our goal is not just to comply with today’s chemical regulations but to continually raise standards to produce solutions as environmentally friendly as possible, with our ultimate goal of enabling customers to produce next-generation products, improve production efficiency, save energy, and reduce their environmental footprint.”
This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. The latter highlights the significance of semiconductor technologies in meeting these requirements.
Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements. Wafer level integration provides advantages over traditional methods, such as increased connection density, smaller footprints for size-sensitive applications, and enhanced performance.
"Advanced" semiconductor packaging specifically includes high-density fan-out, 2.5D, and 3D packaging, characterized by a bumping pitch size below 100 µm, enabling at least 10x higher interconnect densities.
Bandwidth Is Key
To enhance bandwidth from a packaging perspective, two key factors come into play: the total number of I/Os (input/output) and the bit rate per each I/O. Increasing the total number of I/Os requires enabling finer line/space (L/S) patterns in each routing layer/redistribution layer (RDL) and having a higher number of routing layers. On the other hand, improving the bit rate per I/O is influenced by the interconnect distance between chiplets and the selection of dielectric materials. These factors directly impact the overall performance and efficiency of the packaging system.
Unleashing High Bandwidth: Exploring Materials and Processing for Advanced Semiconductor Packaging
Delving deeper into achieving higher wiring density and a higher bit rate per I/O from a materials and processing perspective reveals the critical role played by the selection of dielectric materials and the utilization of appropriate processing techniques. These factors have a significant impact on the overall performance and capabilities of the packaging system.
Selecting suitable dielectric materials is crucial, considering properties like low dielectric constant, optimal CTE (as close to the CTE of Cu as possible), and favorable mechanical characteristics that ensure module reliability, such as Young's modulus and elongation. These choices enable higher data rates while preserving signal integrity and facilitating fine line/space features for increased wiring density.
In high-performance accelerators, such as GPUs, inorganic dielectrics like SiO2 have been extensively utilized to achieve ultra-fine line/space (L/S) features. Nevertheless, their use is limited in applications that demand high-speed connectivity due to their high RC delays. As an alternative, organic dielectrics have been proposed for their cost-effectiveness and ability to mitigate RC delays through their low dielectric constant. However, organic dielectrics present challenges, including high CTE, which can negatively impact the device’s reliability, and difficulties in scaling to fine L/S features.
In addition to selecting appropriate materials, the processing techniques employed during packaging fabrication play a crucial role in achieving a higher number of I/Os and improving the bit rate per I/O. The steps involved in 2.5D packaging processes, including lithography, CMP (Chemical Mechanical Planarization), etching processes, and the CMP and bonding processes in 3D Cu-Cu hybrid bonding, present challenges in achieving tighter routing and increased wiring density. IDTechEx provides detailed insights into how the choice of materials influences the fabrication processes, offering a comprehensive understanding of their impact on advanced semiconductor packaging.
Materials and Technologies Covered in the IDTechEx Report
IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report is divided into four main parts, offering a structured approach to understanding advanced semiconductor packaging. The first part provides a comprehensive introduction to the technologies, development trends, key applications, and ecosystem of advanced semiconductor packaging, providing readers with a solid overview. The second part focuses on 2.5D packaging processes, delving into crucial aspects, including dielectric materials for RDL and Microvia, RDL fabrication techniques, and material selection for EMC and MUF. Each sub-section within this part presents a detailed analysis of process flows, technology benchmarks, player evaluations, and future trends, providing readers with comprehensive insights.
The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D die stacking. This section provides valuable insights into the manufacturing process and offers guidance on material selection for optimal outcomes. It also showcases case studies highlighting the successful implementation of Cu-Cu hybrid bonding using both organic and inorganic dielectrics. Additionally, the report includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presented in the last chapter. This forecast encompasses unit and area metrics, providing the industry with meaningful perspectives into anticipated market growth and trends for the next decade.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP
