WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that is has received approval from an Israeli court to continue with its previously announced share repurchase plan (the “Repurchase Plan”), which was approved by the Israeli court in August 2022.
Yoav Stern, Chairman and Chief Executive Officer, commented: “We continue to fulfill our previous promise to investors, which was temporarily held back due to the time expiration of the existing Israeli court approval. We thank the court for its flexibility in extending the Repurchase Plan period. We are happy to act in a way that both improves the Company’s balance sheet and benefits its shareholders.”
The Repurchase Plan authorizes the Company’s management to repurchase American Depository Shares (“ADSs”), from time to time, in open market transactions, and/or in privately negotiated transactions or in any other legally permissible ways, depending on market conditions, share price, trading volume and other factors. Such repurchases will be made in accordance with applicable U.S. securities laws and regulations, under the U.S. Securities Exchange Act of 1934, as amended (the “Exchange Act”), and applicable Israeli law.
The Company may repurchase all or a portion of the authorized repurchase amount. The Repurchase Plan does not obligate the Company to repurchase any specific number of the ADSs and may be suspended or terminated at any time at management’s discretion.
CHICAGO – Mr. Anaya Vardya, President and CEO of American Standard Circuits, is pleased to announce that on August 25th American Standard Circuits celebrates 35 years of doing business.
Starting with a small facility in the Libertyville, Illinois, ASC has grown to be one of the major leaders in the North American Printed Circuit Board Market. In 1994 the company moved to a larger facility in Franklin Park and then to their current facility in West Chicago in 2004.
During that time there have been several significant changes to the industry and the company.
Founder Gordhan Patel recalls, “When we started American Standard Circuits back in August 1988, we were very small company with one drilling machine, a few plastic tanks, and basic machines. There were almost 600 other shops in North America, no one had even heard of laser drills, laser direct imaging and there were little or no global solutions. We were building only simple single and double-sided boards. It took a while to get some traction but by the time we bought and moved into the facility in West Chicago, we were on our way.”
President and CEO Anaya Vardya came to the company shortly after moving to the new facility and took the reins to lead the company to where it is today. With the recent acquisition of Sunstone Circuits, American Standard Circuits is now a sixty-million-dollar company and one of the industry leaders when it comes to technology, flexibility, capability, and reliability, offering their customers a completely holistic solution from concept to reality.
Mr. Vardya commented, “Of all of the things I have done in my career my work with the team at American Standard Circuits is what I am proudest of. Together we have built a significant company that is making a real difference in the industry. Our growth and success during the past 35 years is a tribute to the vision of our chairman, Gordhan Patel, and all of the great people who have been part of and are still part of the American Standard Circuits team.”
TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is excited to announce an upcoming SMTA Technical Webinar titled "Effectiveness of Strain Gage Methodology for Durable Board Design." The webinar will be presented by Seika Machinery’s principal, James Hara, Principal at Kyowa Electronic Instruments Co., Ltd.
The webinar is scheduled to take place on Tuesday, Sept. 12th, 2023, from 1-2 p.m. Eastern Time. Mr. Hara, a renowned expert in the field of mechanical test and measurement, will delve into the crucial topic of ensuring the mechanical endurance and durability of printed circuit boards (PCBs) in challenging environments.
Printed circuit boards used in applications such as automobiles, commercial vehicles, and electronics are exposed to demanding conditions that require exceptional mechanical endurance. Even the slightest crack or failure in these boards can lead to the overall failure of electronic systems. To prevent such failures and achieve long-term stability, suppliers must assess and understand the mechanical strain and stress levels, identifying critical and high-risk points for potential breakage with stress concentration.
Hara will draw on his nearly 10 years of experience working with Kyowa Electronic Instruments Co., Ltd. and Kyowa Americas Inc. to explore the effectiveness of the strain gage methodology for designing durable and resilient PCBs. The webinar will feature specific case studies that highlight the benefits and real-world applications of this methodology.
Hara has established himself as a leading expert in mechanical test and measurement. Over the past decade, he has provided technical support to industrial engineers using Kyowa's cutting-edge strain gages, signal transducers, and data acquisition technology in various applications. Based in the Michigan area, Hara currently serves as a sales engineer, offering his expertise to support test and measurement projects in both academic and industrial institutions across North America.
Seika Machinery invites professionals in the manufacturing industry to join this insightful webinar and gain valuable insights into ensuring the durability and reliability of printed circuit boards. Registration for the webinar is now open, and participants can reserve their spots by visiting the SMTA website.
For more information, contact Michelle Ogihara at 310-540-7310; e-mail This email address is being protected from spambots. You need JavaScript enabled to view it.; or visit www.seikausa.com
CHANDLER, AZ – Rogers Corporation (NYSE:ROG) (“Rogers”), announced that Griffin Gappert, Ph.D. has joined the company as Vice President and Chief Technology Officer (CTO). He will lead Rogers’ global Research and Development (R&D) organization and partner with business unit leaders to drive innovation and commercialization of next-generation material solutions.
Griffin joins Rogers from Henkel where he was the Global Head of Innovation for Henkel’s Adhesives Automotive OEM business, based in Germany. He brings more than 20 years of experience in the specialty materials and chemicals industries to Rogers. Prior to joining Henkel, Griffin held leadership roles at Ashland Inc., Dow Chemical Company and The Rohm and Haas Company. Griffin holds a PhD in Chemical Engineering from the University of Massachusetts at Amherst and an MBA from the Wharton School of the University of Pennsylvania.
“We are excited for Griffin to join Rogers in this important role,” said Colin Gouveia, Rogers’ President and Chief Executive Officer. “Griffin brings extensive R&D leadership experience from large multinational companies and deep expertise in advanced electronic and elastomeric materials. His broad experience and skillset make him a natural fit for the CTO role at Rogers.”
“I am excited to join Rogers, a global leader in advanced materials-based technologies,” said Griffin. “Rogers has a long history of driving innovation and helping customers solve their most complex challenges. I look forward to leveraging my experience leading global teams to commercialize innovative products to help drive Rogers’ growth.”
OSLO – We are proud to announce that Craig Haywood has successfully completed the EASA Part 21 Subpart G Production Organisation Approval conducted by the UK Civil Aviation Authorities.
“This is a significant milestone for us and reinforces our position as a key partner for global actors in the civil aviation industry”, says CEO Vidar Olsen.
Haywood completed the training earlier this year in the UK.
“As a Printed Circuit partner to several global actors in the Civil Aviation Industry this certificate allows CONFIDEE to audit and support our current manufacturing partners and other partners requested by the product owner”, says Operations Manager Craig Haywood.
“For years in previous positions, I have been on the other side of the table, facing the questions as part of the manufacturing process, this manufacturing knowledge combined with the capability as an EASA Part 21 Auditor will ensure that the proper questions are addressed and handled to secure the product for the product owner”, says Haywood.
Adhering to industry regulations, and stringent standards, as this one set forth by EASA, is aligned with the company's strategy, to be the compliant partner in the Printed Circuit supply chain.
“We will always be the partner that opposes secrecy with transparency, fluffy words with hard facts and actual documentation of compliance, not talk about it or claim it. In this regard, there is no room for compromises”, says Olsen.
CAMBRIDGE, UK – With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.
Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).
The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material's relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.
Dk (Dielectric Constant) and Df (Loss Tangent): A material's dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.
Elongation to Failure: For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.
CTE (Coefficient of Thermal Expansion): To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.
Young's Modulus: For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young's modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.
Moisture Absorption: Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.
In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.
IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP
