SUZHOU, CHINA – Ventec International Group Co., Ltd. (6672 TT), is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark. Both VT-441C and VT-447C FR15.1 materials have thus been recognized for achieving 150oC Maximum Operating Temperature (MOT) for electric and mechanical RTI (Relative Temperature Index).
UL's investigation of Ventec's mid-Tg VT-441C and high-tg VT-447C halogen-free substrates has been completed and full compliance with the applicable requirements including 150oC MOT (Maximum Operating Temperature) for electric and mechanical RTI (Relative Temperature Index) has been determined.
Offering exceptional UL RTI performance, both high-CTI substrate materials ensure reliability in the presence of high applied voltages in harsh and humid environments. With high voltage CAF resistance, Grade 0 (>600V) Comparative Tracking Index (CTI) and glass transition temperatures (Tg) of 155oC and 175oC, the versatile halogen-free materials are the perfect high-reliability PCB choice for use in extreme high-temperature/humidity applications. These include DC/DC power modules, IGBT applications, motor controllers, high lumen output LED devices, battery charging, OBC chargers for EV vehicles and several other automotive “underhood” applications.
The prepregs are available in roll or cut-to-size panel format, with laminates supplied in sheets or cut-to-size panels with core thicknesses of 0.004” (0.10mm) to 0.200” (5mm). They are also offered in a wide range of copper foil thicknesses including heavy coppers. This versatility is ideal for both single layer and multiple layer PCB designs.
Mark Goodwin, COO EMEA & Americas, commented: "Achieving UL authorization for our industry-leading 150oC MOT performance is fantastic news. As a complement to our full halogen-free and thermal management solution series, our customers have access to epoxy materials that meet virtually any high reliability performance requirements for the world’s most demanding applications."
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com
OSLO, NORWAY – Confidee a leading PCB Partner, proudly announces their inclusion to Danish Termas list of approved suppliers.
“We are honored to announce that we are approved as supplier for Danish Termas Space division”, says Vidar Olsen CEO Confidee.
Confidee, focusing on supply chain protection, safeguarding data and compliant printed circuits, has provided both ESA and non-ESA printed circuits for the Danish company.
“Our unwavering commitment to compliance and diligent work to achieve Industry Specific standards as the AS9120, is a given for us when working with highly professional actors as Terma A/S and other Tier 1 partners in the Space and Defence industry. We value our business relationship with Terma A/S highly and are humble for their trust” says Olsen.
AS9120 is a globally recognized standard specifically designed for suppliers in the aviation, space and defence industry operated by the International Aerospace Quality Group (IAQG). It represents the highest level of quality and excellence in the supply chain, ensuring that products and services meet stringent industry requirements and regulations. CONFIDEE’s attainment of this certification underscores its dedication to delivering superior solutions.
SUZHOU, CHINA – Ventec Giga Solutions, the equipment division of Ventec International Group, has started offering a refurbishment service for separator plates used in PCB lamination processes. The service includes plate examination and production of a detailed condition report with assessment of reworking costs, before refurbishment by agreement with the customer. Refurbishment includes removal of unwanted material and restoration of the original surface finish.
“Lamination plates are exposed repeatedly to high stresses during PCB production yet have a profound effect on the surface quality of the PCB,” explained Ramesh Dhokia of Ventec Giga Solutions. “Renewing these plates sooner than necessary, incurs unnecessary costs, and can be time consuming, and Ventec Giga Solutions is now able to offer this innovative and cost-effective alternative that delivers a quality refurbished plate with a fast turnaround.”
This new service is available from Ventec Giga Solutions through the company’s exclusive agreement with Cardel Group and its German subsidiary VTT GmbH. Cardel and VTT are long term experienced producers of lamination separator plates for a variety of applications including PCBs, smart cards, and fuel cells. The company has more than 25 years’ experience producing lamination Separator plates, including development of advanced materials and coatings, and is ideally qualified to provide inspection and refurbishment.
Inspection and reporting are available for all plates supplied by Ventec Giga Solutions’ customers, including original Cardel/VTT plates and plates produced by third parties. Refurbishment is undertaken subject to findings and customer agreement.
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com
SOUTHINGTON, CT – Uyemura has announced an important field promotion, and a new addition to its Connecticut Tech Center Engineering Team. Both actions are in support of the company’s increasing focus on IC substrates, and its role as a supplier to wafer manufacturers, semiconductor fabs and PWB customers.
Russ Schwartz, a Uyemura Senior Mechanical Engineer with 20+ years experience, has been promoted to Project Engineer. Prior to joining Uyemura, Schwartz worked in every stage of wafer fabrication during tenures at Intel and Motorola. In his new position, he will qualify and maintain process lines, assure chemistry performance, and provide mechanical expertise for the design and installation of Uyemura equipment.
Steve Medd is also a veteran of the semiconductor industry, with 15 years experience. At IBM and Entegris, he held posts in applications engineering and process engineering, respectively. In his new position as Uyemura Support Engineer, he provides customer support at the Tech Center metallurgical lab.
HSINCHU – As climate change intensifies, governments worldwide are taking proactive measures to achieve sustainable development goals. In response to this challenge, the Thai government plans to achieve carbon neutrality by 2050 and net-zero emissions by 2065, introducing the Bio-Circular-Green Economy (BCG) model as one of the national development strategies. To accelerate the local industry's transition to net-zero emissions, the Industrial Technology Research Institute (ITRI) and Thailand's National Science and Technology Development Agency (NSTDA) are collaborating to host the "ITRI - NSTDA Joint Seminar" on February 27. The seminar will focus on leveraging innovative technology to drive the bio-circular-green economy, cultivating industries' capabilities for achieving net-zero emissions in the future.
ITRI points out that ASEAN countries such as Thailand and Vietnam have emerged as new global manufacturing hubs, attracting numerous Taiwanese companies for investment. According to customs data, bilateral trade between Taiwan and Thailand has reached $16.238 billion in 2023, with Thailand ranking as Taiwan's 13th largest trading partner. Industries such as printed circuit boards and electric vehicles are flourishing, bringing immense potential for the developments in net-zero emissions and the green economy. The "ITRI - NSTDA Joint Seminar" has invited ITRI President Dr. Edwin Liu and NSTDA President Prof. Sukit Limpijumnong to deliver keynote speeches, sharing their insights on the green economy and sustainable development. Additionally, David Lai, Secretary-General of the Taiwan Printed Circuit Association, will present sustainable development plans for the printed circuit board industry. The seminar will explore three major technological aspects, including sensor technology and applications, smart manufacturing, and hydrogen energy technology applications, creating more cooperation opportunities for both sides.
The "ITRI - NSTDA Joint Seminar" will take place on February 27 at the Thailand Science Park in Pathum Thani. The seminar aims not only to present the key research areas of both ITRI and NSTDA, but also to create a platform for Taiwanese and Thai enterprises to explore further collaboration opportunities for achieving green economy. Registration link: NSTDA-ITRI Joint Seminar 2024
CAMBRIDGE, UK – Electromagnetic interference shielding is becoming more adapted to the meet demands of growing communications technology. Personal devices are everywhere. As they get thinner, the components in each device are getting closer together, and EMI shielding is becoming well-known as the mastermind.
Delicate signal
People are drawn to the latest smartphones for their up-to-date technology and high-quality communication. 5G network connections bring a faster data range, but what people don’t realize is that these high frequencies are much more delicate. EMI shielding works to prevent even the slightest interference.
The process of EMI shielding is now done on such a small scale that it allows phones to be smart and sleek, leaving bulky devices too big for pockets in the past and making them more streamlined. Where shielding used to be done on a larger yet more simplified scale, it is changing to make way for what the technology markets demand and is proving successful, so much so that the average consumer might not even be aware it exists.
Smooth talking
Mobile phones are becoming neater and more aesthetically pleasing each year, and the modernity extends itself to the hidden technology too. Where antennas used to be large and rather obvious parts of a phone, they are now small enough to fit inside and even do a better job than they used to.
This means other components, such as radio frequency chips, need even sturdier shielding to not interfere with the antenna’s functioning.
Board-level shielding using metallic box-shaped enclosures has been used for a long time to prevent electromagnetic signals from interfering with antennas. However, conformal package-level shielding is expected to become widespread in the coming years as system-in-package architectures become more present in miniaturized commercial electronics. To achieve this, it is imperative that the shielding materials not only have high conductivity and shielding effectiveness but are also low-cost to procure and are compatible with standard scalable deposition techniques.
With increasing frequencies being able to attain quick and high-quality signals, shielding is working to match up to the delicate nature of these frequencies. Developments are on the horizon for new ways to shield these parts using intricate spray techniques and the introduction of metallic inks, such as silver, that offer stronger and particle-free protection. These shiny new techniques could one day replace the tiny boxes made with plastics and metals that are already in use. Selective deposition could offer even more precise shielding and allow for the further miniaturizing of devices without compromising effectiveness.
The developments of EMI shielding have had to keep up with the rapid changes in mobile phone design, demonstrating just how capable and fast-paced this technology can be. While it may have been overlooked in the past, it is gaining recognition as devices require higher frequencies and benefit people every day. Its compatibility with changing trends proves that the materials and techniques used in the process are good at adapting and are becoming more reliable.
