Press Releases

Santa Clara, CA – APCT, a leading name in the PCB and electronics industry, is delighted to announce the appointment of Peter Austin as its President and CEO, effective September 1. Peter takes the reins from former CEO, Steve Robinson, who has retired after years of dedicated service to the company.

Peter Austin joins APCT with a rich history in the semiconductor and electronics sector, spanning over 25 years. Most recently, Peter served as the Chief Operating Officer (COO) at PEI Genesis, a global leader in the distribution, manufacturing, and integration of electronic connectors and cable assembly solutions. Recognized for his forward-thinking approach, exceptional drive, and strategic C-suite leadership, Peter Austin is poised to lead APCT into a new era of growth and innovation. In his role as President and CEO, he will oversee all of APCT's facilities, with corporate responsibilities extending to Engineering, Manufacturing, Finance, Sales & Marketing, and Business Development across all divisions.

Commenting on his appointment, Peter Austin said, "I am honored to join APCT, a company with a strong legacy of excellence and innovation in the PCB and electronics industry. I look forward to working alongside our dedicated team to drive growth, deliver exceptional value to our customers, and lead APCT to new heights."

Peter Austin expressed his commitment to the company's future, saying, "I firmly believe that we possess the talent, technology, and passion to continue to substantially grow APCT in the coming years. My goal is to grow our revenue, profitability, and global footprint. In line with this vision, APCT will be placing a strong emphasis on becoming a customer-centric company, with a unified sales organization and selling approach."

The APCT team is confident that Peter Austin's wealth of experience and leadership will play a pivotal role in advancing the company's mission and ensuring continued success.

SAN JOSE, CA – Cadence Design Systems Inc. and the Vietnam National Innovation Center (NIC) under the Ministry of Planning and Investment (MPI) have launched a new program aimed at accelerating IC design innovation in Vietnam.

Through the collaboration, NIC will provide Vietnam universities, training centers, and start-up companies with the technology and education required to design and develop products for the fast-growing, local semiconductor and electronics ecosystem. Cadence will provide access to its tools to academic institutes selected by NIC, providing students with an opportunity to gain real-world experience creating innovative IC designs.

H.E. Pham Minh Chinh, Prime Minister of Vietnam, and H.E. Nguyen Chi Dzung, Minister of Ministry of Planning and Investment observed the signing ceremony with other leaders in the Vietnamese delegation during a visit. Cadence representative, Karna Nisewaner, corporate vice president, general counsel and secretary, and Vo Xuan Hoai, vice director of NIC signed a Memorandum of Understanding (MoU) on September 19, 2023. Other industry, academic and government representatives also participated in the ceremony.

According to Nguyen Chi Dzung, the Vietnamese Government, especially Prime Minister Pham Minh Chinh, is very interested in promoting investment cooperation and developing the semiconductor industry in Vietnam; assigned the Ministry of Planning and Investment, the Ministry of Information and Communications, and other ministries to develop an action program to develop this industry in Vietnam and enhance a human resource development project with the goal of forming 50,000 engineers for this industry by 2030. The cooperation between NIC and Cadence will contribute to the development of human resources and businesses in the design and product development of semiconductor chips in Vietnam and strengthen the relationship between Vietnam and the United States in enhancing the capacity of the innovation ecosystem and semiconductor industry.

The NIC is establishing the infrastructure for the IC design incubation center at Hoa Lac High-Tech Park, Hanoi, where academic institutes selected by NIC can leverage Cadence’s portfolio of industry-leading technology to create a wide variety of designs, including 5G, IoT, Automotive, Artificial Intelligence (AI), and 3D-IC packaging.

There are several aspects of the collaboration that will benefit the local market in Vietnam. For example, local university students and professors will have access to the Cadence support and Online Training Suite, providing a unique opportunity to gain real-world IC design experience. Cadence will connect and introduce internship and job opportunities to Vietnamese engineers trained at NIC.

In addition, Cadence will connect and introduce NIC and Vietnamese universities to prestigious universities worldwide, to collaborate on IC design programs and courses. In parallel, Cadence will introduce NIC to governments, organizations, businesses, and corporations in the semiconductor industry in the United States and around the world. Also, NIC will set up a start-up incubator, which will include the required infrastructure, and Cadence will support start-up companies with product development that will enable them to raise investments and commercial agreements.

“NIC is focused on advancing the Vietnamese innovation ecosystem, driving growth in high-tech areas like the semiconductor industry that can fuel our local economy,” said Vo Xuan Hoai, Vice Director of NIC. “Our collaboration with Cadence will provide students, professors, and start-ups with the technology and support they need to create quality systems that advance Vietnam’s position in the tech space.”

“We are committed to putting our tools in the hands of next-generation innovators around the world, and this latest collaboration with NIC fosters chip design advancement in Vietnam,” said Michael Shih, corporate vice president of sales for Asia Pacific and Japan at Cadence. “NIC has a pivotal role in the region, and we look forward to working together to ensure engineers have the resources they need to gain practical experience and enable our customers to achieve design success.”

The NIC was established by the Prime Minister of Vietnam in Decision No. 1269/QD-TTg, dated October 2, 2019, with the mission of supporting and developing the Vietnamese innovation ecosystem in many high-tech sectors, including the semiconductor industry, accelerating the country’s growth model based on science and technology.

WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that is has received approval from the Israeli court to continue with its previously announced share repurchase plan (the “Repurchase Plan”), which initially was approved by the Israeli court in August 2022, until October 12, 2023.

Yoav Stern, Chief Executive Officer of the Company, commented: “We continue to fulfill our previous promise to investors, which was temporarily held back due to the time expiration of the Israeli court approval. We thank the court again for its flexibility in extending the Repurchase Plan period. We are happy to act in a way that both improves the Company’s balance sheet and benefits its shareholders.”

The Repurchase Plan authorizes the Company’s management to repurchase American Depository Shares (“ADSs”), from time to time, in open market transactions, and/or in privately negotiated transactions or in any other legally permissible ways, depending on market conditions, share price, trading volume and other factors. Such repurchases will be made in accordance with applicable U.S. securities laws and regulations, under the U.S. Securities Exchange Act of 1934, as amended, and applicable Israeli law.

The Company may repurchase all or a portion of the authorized repurchase amount. The Repurchase Plan does not obligate the Company to repurchase any specific number of the ADSs and may be suspended or terminated at any time at the Company’s sole discretion.

WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension”, “Nano” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, today announced that its Board of Directors (“the Board”) has appointed Dr. Yoav Nissan-Cohen as Chairman of the Board, effective immediately. Yoav Stern will continue as the Company’s Chief Executive Officer and Director. In addition, Col. (Ret.) Channa Caspi announced that she will be stepping down from the Board due to personal medical circumstances, effective immediately. Following the departure of Col. (Ret.) Caspi, the Board will be reduced from nine to eight directors.

Dr. Nissan-Cohen joined Nano’s Board of Directors in December 2022. His career covers almost 40 years of scientific research, technology development, and executive management in the high-tech industry. He started his career as a research scientist in General Electric R&D Center in New York.

In 1988 Dr. Nissan-Cohen joined National Semiconductor as a technology development manager, and in 1993 he was one of the founders of Tower Semiconductor (Nasdaq:TSEM), where he served as a CEO, took the company public in NASDAQ and built a $1.5B advanced semiconductor facility.

Dr. Nissan-Cohen is the Chairman of TeraCyte, a biotechnology company which developed a platform for high throughput temporal analysis of live single-cells, with breakthrough applications for research, discovery, and development of new drugs and therapies.

In 2002 he joined Pitango as a venture partner, and in 2004 he came back to his entrepreneurial origin and took the Chairman and CEO position in Amimon, a semiconductor company which until today provides the only solution for zero-latency wireless camera link for various applications such as operating rooms in hospitals and TV and film productions.

Dr. Nissan-Cohen is also the Chairman of Visionlab, a company specializing in advanced vision-based solutions for industrial and military applications. He founded and managed several other companies, including a joint venture with Emmy Award winning directors to bring game changing solutions to the film and TV productions. Currently, Dr. Nissan-Cohen serves also as an executive board member in Weebit, a semiconductor company developing a new class of semiconductor memories.

Dr. Nissan-Cohen holds a Ph.D degree in Physics from the Hebrew University of Jerusalem.

Yoav Stern, CEO of Nano Dimension, commented, “We’ve considered feedback from our shareholders, as well as the recommendations of governance experts, ISS and Glass Lewis, and have decided to make changes to our Board that we believe will evolve and enhance our corporate governance. As we move into the next phase of executing our strategic plan, separating the Chairman and CEO roles is an important step in strengthening Nano’s governance practices and increasing independent oversight by the Board. We remain committed to maintaining the right balance of strong and consistent leadership to guide Nano in the years ahead, while delivering value for our shareholders.

“On a personal level”, add Mr. Stern, “it is a unique opportunity for me to be able to work closely with Dr. Nissan-Cohen, gaining from his vast experience and unique business and leadership vision. I look forward to learning from him and to excel together with him for the betterment of Nano Dimension, its shareholders and all other relevant constituencies”

Dr. Nissan-Cohen responded, “I am confident in Nano, and I look forward to working with Yoav, my fellow Board members and the management team as we continue to execute Nano’s strategy and drive value for shareholders.”

Mr. Stern added, “Nano, and me personally, are sad to part ways with Channy. She has consistently made impactful contributions to Nano and provided expert guidance to our teams with her personal and professional insightful input. On behalf of the entire Board and management team, I would like to wish Channy a speedy recovery and return back to full healthy functionality, and we are all highly thankful for her valuable wisdom and dedicated service. We and me individually were very fortunate to have her as a unique and integral part of us”

TAOYUAN, TAIWAN – On Thursday, 14 September 2023, the Thailand Trade and Economic Office (TTEO), together with the Taiwan Printed Circuit Association (TPCA), organized the “Thai Student PCB Job Fair” at the TPCA Building in Taoyuan County. In light of the geopolitical considerations impacting the PCB industry supply chain, several companies have planned to invest in new facilities in Thailand this year. To assist the industry in addressing the pressing need for Thai talent in these new facilities, this job fair serves as a bridge between the employment needs of Taiwanese companies and the Thai students studying in Taiwan. It aims to help Thai students gain a deeper understanding of the significance of the PCB industry and facilitate bilateral exchanges between Taiwan and Thailand.

Mr. Twekiat Janprajak, Executive Director of Thailand Trade and Economic Office, presides over the event by emphasizing the importance of people-to-people connection, which is one of the crucial factors in attracting foreign investment. Working experience with Taiwanese companies will also offer Thai students world-class training and technology transfer. As a result, Thailand and Taiwan will be able to work closely towards producing a resilient and sustainable supply chain, which will benefit the whole region.

Ms. Michelle Hung, Executive Deputy Secretary General of the Taiwan Printed Circuit Association (TPCA), emphasized that since the easing of the pandemic situation, the Taiwanese PCB supply chain has been responding to customer demands for risk diversification by planning to establish new facilities in various Southeast Asian countries. As companies continue to announce their investment plans, Thailand is poised to become the third industrial cluster for Taiwanese PCB manufacturers. It is estimated that this wave of investment in Thailand will amount to approximately 43 billion Thai Baht, creating over 15,000 job opportunities and making a substantial contribution to both the Thai and Taiwanese economies.

The event gathered the attention of a broad range of Thai students studying in Taipei and the surrounding areas. There were approximately 100 students who attended from several educational backgrounds, be they liberal arts, engineering, business or language studies. The Taiwanese businesses participating in the event consisted of more than twelve leading PCB companies, including Zhen Ding Technology, COMPEQ, Unimicron, WUS Group, Gold Circuit Electronics, Unitech PCB, Wah Lee Industrial Corp, YANKEY Engineer, Shinbu Corporation, Topoint Technology, READY WELL, TALIANG Technology, and DAIDALOS Enterprise. This event has provided a great platform for Thai students in Taiwan to gain a deeper understanding of the PCB industry and to get acquainted with Taiwanese companies. It opens up possibilities for them to potentially join the Taiwanese PCB industry in the future and contribute their expertise to Taiwanese enterprises. TPCA will continue to focus on the talent supply and demand issues between Taiwan and Thailand, actively promoting collaborations between academia and industry in Thailand and offering professional training programs. This commitment aims to strengthen the resilience of the Taiwanese PCB industry within the global supply chain.

SHANGHAI – Vayo Technology, a global provider of industrial software solutions for interconnected electronic systems from design to manufacturing, is pleased to announce plans to exhibit at PCB West 2023. The event is scheduled to take place Wednesday, Sept. 20, 2023 at the Santa Clara Convention Center in California. Vayo Technology will discuss DFX know-how digitalization and how to build your own digital know-how library in Booth #510.

With its robust DFX Design Execution System Software, Vayo Technology is at the forefront of providing intelligent system platform solutions for enterprise electronic design and process departments. The system offers a transformative approach to automating the review, analysis, and digital management of PCB/PCBA design data.

PCB West 2023 provides a unique platform for industry professionals and enthusiasts to gather and explore the latest advancements in the field of printed circuit boards. Vayo Technology is excited to contribute its insights into DFX know-how digitalization and showcase how its solutions empower enterprises to optimize their design and manufacturing processes.

Visitors to Booth #510 can engage with the Vayo Technology team to gain insights into the benefits of DFX know-how digitalization. By streamlining and automating design data review and analysis, Vayo's solution enables businesses to enhance their overall productivity, reduce errors, and optimize collaboration between design and manufacturing teams.

Vayo Technology invites attendees to discover the potential of DFX know-how digitalization and explore the possibilities of building their own digital know-how library. The company's expertise in intelligent manufacturing solutions positions them as a valuable resource for professionals seeking to stay at the forefront of industry trends and advancements.

To learn more about VayoPro-DFM Expert, visit 3D DFM/DFA solution.

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