Press Releases

BANNOCKBURN, IL — Executives and staff at a San Francisco Bay Area manufacturing facility held a town hall discussion with Rep. Ro Khanna (D-CA) on the federal policy issues facing the manufacturing industry under the Trump Administration.

Read more: Newly Elected Congressman Discusses US Policy Priorities with Bay Area Manufacturers

TUALATIN, OR — For the past 40 years, LPKF has been the global market leader in the field of systems for manufacturing PCBs in development laboratories. And now the Garbsen-based company is rounding off the high-end of this segment with a world first: the ProtoLaser R is the first system optimized for the use in development departments using an ultrashort picosecond pulse laser, allowing it to work on highly sensitive materials thanks to the lack of heat input.
With its compactness and price, the LPKF ProtoLaser R is currently one of a kind on the market.

Read more: LPKF Announces First Sales of the New ProtoLaser R in Asia

WATERBURY, CT – MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will present two papers at the IPC APEX Expo 2017 being held in San Diego, California, Februrary 14-16, 2017.

Read more: MacDermid Enthone Electronics Solutions to Present Papers at IPC Apex Expo 2017

The German PCB specialist KSG Leiterplatten GmbH is expanding its capacity by a DES line from SCHMID.

Read more: KSG orders DES line with New Etching Options

BANNOCKBURN, Ill., USA, December 19, 2016 — IPC APEX EXPO 2017 attendees can network with industry colleagues, make new connections, and interact with more than 450 exhibitors in one place at one time at the San Diego Convention Center, February 14–16.

Read more: Experience Technology’s Turning Point Through IPC APEX EXPO 2017 Free Networking Opportunities

AT&S will be presenting its latest technologies and products at Nepcon 2017 in Tokyo from 18-20 January.

LEOBEN AND TOKYO – At Nepcon 2017 (18-20 January 2017) in Tokyo, AT&S will be presenting innovative technologies as a response to current challenges in telecommunication, automotive electronics, wearables and medical electronics. Advancing miniaturisation, high data rates and/or high frequencies, power electronics with increasing current densities and rising thermal problems, as well as optimised production processes are the challenges that modern applications face. AT&S will therefore present solutions for extremely compact substrates/modules, advanced heat management, Embedded Component Packaging (ECP®), HF printed circuit boards (PCBs) (such as automotive radar) and flexible PCBs for medical devices.  

Read more: AT&S develops innovative products facing the rising challenges of advancing miniaturisation,...

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