NORWOOD, MA -- Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes.

International Electronic Components Inc. (IEC) and ATG are pleased to announce a partnership expansion. IEC has been awarded additional North American sales, service and distribution rights to ATG equipment in Illinois and Wisconsin.

For customers, the addition of these territories means an integrated North American service and supply network of tier one equipment, products, and services from IEC. “We’re looking forward to expanding our relationship with IEC - they have proven their ability to service and supply our customers over many years,” states Klaus Koziol, Vice President of Sales, Americas, Korea and South East Asia for ATG.

“We are currently serving Wisconsin and Illinois with other products and services and this will add to our growing portfolio for customers,” says Shawn Stone, President of IEC. “We’re excited to continue to grow the North American presence representing ATG and bringing world class equipment to existing and new customers

Stevenage Circuits is pleased to announce that they have selected Electra Polymers EMP110 direct image spray soldermask for use on the AHK double sided solder mask spray system in conjunction with their Limata, Orbotech Nuvogo and Orbotech Paragon direct imaging systems.

PALATINE, Illinois, USA, April 5, 2017 –SelectConnect Technologies has published the white paper, “Trace Width and Space Limitations for Laser Direct Structuring.”