Conductor Analysis Technologies (CAT) has announced the sale of two OM Thermal Stress Systems to TTM Technologies, Sterling Virginia. “This is a significant step in the adoption of reflow simulation for bare board acceptance by the industry,” said Tim Estes, Chief Technology Officer at CAT.

Read more: Conductor Analysis Technologies (CAT) Provides Test Systems to TTM Technologies

Leoben, 25 April 2017 – Fraunhofer IAF has developed a fully integrated monolithic multilevel converter in high-volt AlGaN/GaN-on-Si technology. The integrated inverter circuit is designed for maximum voltages of +/- 400 V and currents of 5 A.

Read more: ECP Technology from AT&S Enables Evaluation of a Fully Integrated Multilevel Power Converter on...

Insulectro, the largest distributor of materials for use in printed circuit boards and printed electronics, has just added popular constructions of DuPont’s flexible laminates to its PumaFast stocking inventories.

Read more: Insulectro Adds DuPont Pyralux Laminates to Ready-to-Ship Pumafast Inventory Program

April 24, 2017 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs is pleased to announce the appointment of Kyle Pattie as Account Manager for the US Eastern region, selling and supporting all product lines to help the company further develop its presence in the region.

Read more: Ventec International Appoints Kyle Pattie as Account Manager, Eastern USA