Orbotech Ltd. has announced that HON-Flex has chosen InCAM Flex as its preproduction CAM solution. Developed by Frontline PCB Solutions, InCAM Flex is a dedicated industry-leading, field-proven preproduction CAM solution, for flex and rigid-flex PCB makers that provides precise CAM tooling and production data optimization via flex design for manufacturing tools.
DOWNERS GROVE, ILLINOIS -- March 9, 2017 -- Hirose, a leader in the development of innovative connector solutions, has expanded its North American sales and application engineering support services with the opening of a new office in Andover, Massachusetts. The New England-based office offers sales and technical support that strengthens Hirose's ability to quickly meet customer requirements. The new east coast office reflects Hirose's growth in North America, and demonstrates its continued commitment to customers and channel partners.
BANNOCKBURN, Ill., USA, March 6, 2017 — IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO® 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018.
COSTA MESA, CA –March 2, 2017, TTM Technologies, Inc. (Nasdaq: TTMI) will be exhibiting at the Electric & Hybrid Vehicle Technology Expo Europe 2017 at Booth B205.
HAVERHILL, MA --IMI, Inc. announced today that they have acquired and installed a Micro-Vu Excel 661 UCL Measuring System.
Santa Clara, CA, February 17, 2017 -- Cirexx International and Technica USA announced today the sale by Technica of a second Direct Imaging (DI) unit to Cirexx International Inc. The new equipment is the latest in technology offered by Technica’s supply partner, Chime Ball Technology (CBT). CBT purchased the DI technology from Maskless Lithography Inc (MLI) approximately two years ago. CBT has quickly advanced the production proven LED technology to include multiple wavelength UV imaging with the capability of imaging 35 micron features.