Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability concerns from some customers, coupled with the option of lower-priced flip chip CSP substrates, prompted Qualcomm to lower its FO-WLP forecast this year and next. While Qualcomm’s forecast may be lower, others are stepping in to use recently installed capacity. FO-WLP has been adoption for some radar modules in vehicles equipped with advanced driver assist systems (ADAS) by companies including Infineon and NXP. Adoption of fan-out on substrate for high-performance applications is expanding.

Read more: TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

Orbotech Ltd. announced today that FTG (Firan Technology Group) Circuits has updated and expanded the PCB production capacity in their Toronto, Ontario facility with new DI (Direct Imaging) and AOI (Automated Optical Inspection) solutions from Orbotech.

Read more: FTG Circuits Invests in Additional Orbotech DI and AOI Solutions for PCB Production Upgrade