WATERBURY, Conn, USA, July 13, 2018– MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will present at the Advances in Thermal Management Conference which will take place at the Hyatt Regency Denver Tech Center, Denver, CO August 8-9, 2018. The conference gathers organizations in the electronics industry supply chain that depend on the precise dissipation of heat in electronic devices.

The presentation, titled: “Understanding Thermal Demands for PCB Design and Developments in Fabrication“, will be delivered by Rich Bellemare, Global Applications Manager, Metallization, on Thursday, August 9th at 10:00am.

Lenora Clark, Director of OEM Applications, who co-authored the paper with Bellemare and Bill Bowerman, Director of Metallization, states, “New functional demands in the automotive industry are forcing change in the design and fabrication of PCB’s. These changes affect electrical performance and heat management. This paper explains how a unique electroplating method can increase the PCB’s ability to manage heat and increase the life of the product.“

For more information on our latest advances in thermal management, contact Lenora Clark at This email address is being protected from spambots. You need JavaScript enabled to view it..

Register now for PCB WEST, the leading trade show for the printed circuit design and electronics manufacturing industry! Coming Sept. 11-13 to the Santa Clara Convention Center.

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